![ATS-20E-200-C3-R0 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | ATS-20E-200-C3-R0-ND |
Manufacturer Part#: |
ATS-20E-200-C3-R0 |
Price: | $ 3.81 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X10MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.45933 |
30 +: | $ 3.36588 |
50 +: | $ 3.17898 |
100 +: | $ 2.99193 |
250 +: | $ 2.80496 |
500 +: | $ 2.71146 |
1000 +: | $ 2.43095 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are a vital component of many thermal management solutions. The ATS-20E-200-C3-R0 is a high performance heat sink designed for use in high power applications such as power supplies, network equipment, LED lighting, medical devices and industrial computers. This device is designed to provide an improved thermal performance compared to other traditional air cooled heat sink solutions.
The ATS-20E-200-C3-R0 is constructed from aluminum which makes it highly efficient in a variety of heat transfer applications. The design of the device incorporates an anodized aluminum heat spreader which is then connected to a 2-piece fin layout which helps to dissipate the heat away from its source quickly and effectively. The design of the fins and their spacing also helps to maximize heat dissipation and the overall thermal performance.
The ATS-20E-200-C3-R0 utilizes a patented direct contact technology which helps to improve thermal performance. This technology ensures that heat from the power source is transferred to the heat sink quickly and efficiently, allowing for greater cooling power. The design also features four unique thermal zones which help to further improve the heat transfer process and provide better overall thermal performance.
The ATS-20E-200-C3-R0 is designed to work with a wide range of electronic devices and components. It is suitable for use with a variety of power supplies, LED drivers, server motherboards, and other high power components. The device also offers an integrated mounting system which allows for easy and secure installation onto a variety of electronic components. The mounting system is compatible with a range of mounting plates and screws, making installation and removal of the device fast and easy.
The thermal performance of the ATS-20E-200-C3-R0 can be further enhanced by the addition of optional accessories such as the ATS-20E-200-C3-R0 Fan Set, which includes a high speed fan that helps to increase the airflow around the heat sink and improve its thermal performance. Additionally, the device can be used with a range of thermal paste products to help improve thermal management, allowing for better heat transfer and cooling power.
In conclusion, the ATS-20E-200-C3-R0 is a highly effective heat sink designed for use in many high power electronic applications. The device offers an improved thermal performance compared to other air cooled heat sinks, and features a patented direct contact technology that allows for improved heat transfer. Additionally, the device offers an integrated mounting system which allows for quick and secure installation onto a variety of electronic components. With the addition of optional accessories such as fans and thermal paste, the ATS-20E-200-C3-R0 can offer an even higher level of thermal performance. This makes it a great choice for anyone looking to improve the cooling power of their electronic components.
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