ATS-20E-24-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20E-24-C1-R0-ND

Manufacturer Part#:

ATS-20E-24-C1-R0

Price: $ 4.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20E-24-C1-R0 datasheetATS-20E-24-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.08303
30 +: $ 3.85623
50 +: $ 3.62943
100 +: $ 3.40257
250 +: $ 3.17573
500 +: $ 2.94889
1000 +: $ 2.89218
Stock 1000Can Ship Immediately
$ 4.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are widely used in many types of applications and can help to cool down equipment and reduce the amount of heat that is produced. Their primary purpose is to dissipate the heat away from the heat source, usually by using a combination of heat transfer such as convection and conduction, or both. The ATS-20E-24-C1-R0 thermal-heat sink is a popular choice for those looking to improve the performance of their equipment. Here, we will take a look at this product and explore its application field and working principle.

What is the ATS-20E-24-C1-R0 Thermal-Heat Sink?

The ATS-20E-24-C1-R0 thermal-heat sink is designed to provide an effective and efficient way to dissipate heat away from electrical components. The sink works by utilizing a combination of both convection and conduction to reduce the temperature of any electronic component that has been placed on the device. It is able to handle a vast range of temperatures ranging from -20°F to +320°F.

This device also comes with a set of fan-less mounting brackets which allow the sink to be securely attached to a printed circuit board (PCB) without the need for additional hardware. It has been designed to operate at a maximum temperature of 75°C and can provide a maximum power dissipation rate of 10 Watts.

What is the Application Field of ATS-20E-24-C1-R0 Thermal-Heat Sink?

The ATS-20E-24-C1-R0 thermal-heat sink is commonly used in the field of electronics in order to cool down components. It is a popular choice for many PCBs, including those that are used for LED display design, telecommunications, automotive electronics, and computer technology. It is also regularly used in HVAC systems, medical equipment, and industrial automation.

In addition to its electronics applications, the ATS-20E-24-C1-R0 thermal-heat sink is also used to cool down computer processors, and is often chosen for CPU cooling applications. This type of heat sink is also great for cooling down power supplies, and is often found in server racks and data centers.

What is the Working Principle of the ATS-20E-24-C1-R0 Thermal-Heat Sink?

The working principle of the ATS-20E-24-C1-R0 thermal-heat sink is based upon the principle of thermodynamically coupled airflows. This means that the heated air, which is produced by the component being cooled, is drawn away from the component and pulled towards the heat sink, where it is cooled by natural convection. This causes the component\'s temperature to decrease, thus making it more efficient and reliable.

Conversely, the heat sink is able to dissipate the Heat away from the component by means of conduction. This is done by attaching the component to the sink using a metal clip or a conductive thermal pad. The heat is then conducted away from the component and towards the sink, where it is dissipated.

Both convection and conduction are essential components of the ATS-20E-24-C1-R0 thermal-heat sink in order for it to be able to effectively cool down a range of components without risking their reliability or performance. By utilizing both processes at the same time, the heat sink is able to provide a highly efficient cooling solution for any electronics setup.

Conclusion

The ATS-20E-24-C1-R0 thermal-heat sink is an excellent option for those wanting to improve the performance and reliability of their electronics. It utilizes a combination of convection and conduction to effectively dissipate heat away from components, while still being able to handle a vast range of temperatures. Furthermore, its simple mounting system makes it easy to install, allowing it to be used in many different application fields.

The specific data is subject to PDF, and the above content is for reference

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