
Allicdata Part #: | ATS-20E-28-C1-R0-ND |
Manufacturer Part#: |
ATS-20E-28-C1-R0 |
Price: | $ 6.22 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 70X70X15MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.59818 |
30 +: | $ 5.28738 |
50 +: | $ 4.97624 |
100 +: | $ 4.66528 |
250 +: | $ 4.35426 |
500 +: | $ 4.04324 |
1000 +: | $ 3.96549 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.756" (70.00mm) |
Width: | 2.756" (70.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.590" (15.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.57°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal management is a critical element in the design of electronic components. It is necessary to maintain the temperature of components within a certain range under maximum operating conditions, while also ensuring that their performance remains consistent. That’s why choosing the right type of heat sink is an important decision.
The ATS-20E-28-C1-R0 heat sink is a type of extruded aluminum-based heat sink. It has a thermally efficient finned design for extra thermal dissipation capabilities. It is available in two sizes and offers various mounting options for various application needs.
Application Field
The ATS-20E-28-C1-R0 heat sink can be used for a wide range of applications, including electronic devices such as telecommunications, computers, automotive electronics, consumer electronics, medical electronics, industrial electronics, HVAC systems, and other similar devices that require heat dissipation. As a result, the ATS-20E-28-C1-R0 is suitable for many different types of electronic products, from computers to cars.
Working Principle
The ATS-20E-28-C1-R0 heat sink works by dissipating the heat generated by the electronic components it is placed near. It takes the thermal energy generated by the component and transfers it to the heat sink with the help of a thermally conductive material. Heat then draws away from the component and dissipates out of the heat sink.
The ATS-20E-28-C1-R0 is made of aluminum, which is an efficient material for thermal transfer. The aluminum fins of the ATS-20E-28-C1-R0 are designed to increase the heat dissipation rate by providing more surface area for heat transfer. The fins also serve as air ducts, allowing more air to flow through the heat sink, further aiding in increasing the heat dissipation rate. The addition of a fan can further increase the cooling performance of the ATS-20E-28-C1-R0 heat sink.
The ATS-20E-28-C1-R0 heat sink is also able to be mounted easily, allowing it to fit into a variety of applications. Its mounting options for through-hole, press-fit, or snap-fit installation makes it easy to install and allows the user to adjust the orientation of the heat sink. This makes the ATS-20E-28-C1-R0 an ideal choice for many applications.
Conclusion
The ATS-20E-28-C1-R0 heat sink is a reliable and efficient choice for various thermal management needs. Its efficient fin design, aluminum construction, and easy mounting make it suitable for a wide range of applications. Its easy installation and adjustable orientation make it well suited for different types of electronic products, such as computers, telecommunications, and automotive electronics. The ATS-20E-28-C1-R0 is an excellent choice for any project that requires a good heat dissipation device.
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