| Allicdata Part #: | ATS-20E-56-C1-R0-ND |
| Manufacturer Part#: |
ATS-20E-56-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-56-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal - Heat Sinks
Heat Sinks are devices used to transfer and dissipate heat generated from electrical components of varying shapes and sizes. An ATS-20E-56-C1-R0 is a popular Thermal Heat Sink used in many applications, due to its reliable performance and durability. In this article, we will discuss the application field and working principle of the ATS-20E-56-C1-R0 Heat Sink.
The ATS-20E-56-C1-R0 Heat Sink is used in a wide range of applications, such as consumer electronic products, power modules, automotive components, medical equipment, and many other general industrial applications. The ATS-20E-56-C1-R0 Heat Sink is a versatile thermal management solution that can be used for any application where heat must be managed and dissipated quickly and efficiently.
The ATS-20E-56-C1-R0 Heat Sink is designed to work in two different ways: passive cooling or active cooling. In passive cooling, the Heat Sink simply radiates the heat generated from the electronic components and dissipates it in the surrounding environment. This type of cooling is cheaper and more effective, but requires a larger amount of surface area on the Heat Sink to efficiently dissipate the heat. Active cooling involves using fans to draw the heat away from the components and dissipate it into the environment.
The ATS-20E-56-C1-R0 Heat Sink uses an extruded aluminum alloy that is designed to dissipate heat rapidly and efficiently. The Heat Sink features a variety of options in either a single-extrusion, two-extrusion, or four-extrusion design. The extrusion design ensures that the maximum amount of surface area is exposed to the environment, allowing the ATS-20E-56-C1-R0 to effectively and quickly dissipate heat from the components.
The ATS-20E-56-C1-R0 Heat Sink also utilizes an innovative thermal management feature called Vapor Chamber Technology. This technology allows the Heat Sink to make efficient use of the available air and remove heat from the components more efficiently and quickly. This technology also eliminates the need for a fan, which can add unnecessary cost, weight, and maintenance.
The ATS-20E-56-C1-R0 Heat Sink also offers a variety of mounting options. It can be mounted horizontally or vertically, depending on the application. The Heat Sink can also be soldered or screwed onto the power module or embedded components, and it can also be mounted with clips or straps for added flexibility.
In conclusion, the ATS-20E-56-C1-R0 is a highly efficient and reliable thermal management solution. It can be used for a wide range of applications, due to its versatile design and features. It offers passive and active cooling, and can be mounted in various ways. The Vapor Chamber Technology ensures maximum thermal transfer and dissipation, and eliminates the need for a fan, making the ATS-20E-56-C1-R0 an ideal thermal management solution.
The specific data is subject to PDF, and the above content is for reference