| Allicdata Part #: | ATS-20E-59-C1-R0-ND |
| Manufacturer Part#: |
ATS-20E-59-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-59-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-20E-59-C1-R0 is a type of thermal - heat sink, which is used to help regulate temperature in electronic devices. The thermal - heat sink, which is typically constructed from extruded aluminum, is designed to dissipate heat away from the device in which it is installed. This allows the device to operate at a cooler temperature, thus increasing its longevity and reliability.
The ATS-20E-59-C1-R0 thermal - heat sink is typically designed for applications in which the dissipated heat is generated by power transistors, ICs, voltage regulators, or other semiconductor devices. The heat sink utilizes a combination of its extruded aluminum construction and fin cooling technology to ensure optimal performance. It can also be combined with powerful fans to further improve cooling capabilities by drawing in cooler air from outside the device and expelling the hot air away from the device.
The ATS-20E-59-C1-R0 thermal - heat sink consists of a main body that is constructed from extruded aluminum. This main body holds several fins, which are placed in alternating shapes along the surface of the main body. These fins allow air to pass through, thus cooling the surface of the main body. Additionally, there are solderable pins that are connected to the main body, allowing the heat sink to be mounted on a variety of devices, including semiconductor components.
The ATS-20E-59-C1-R0 thermal - heat sink works by absorbing the heat produced by the semiconductor components and dissipating it away from the device. In order to ensure optimal cooling performance, the fins of the heat sink must be oriented in a way that allows for maximum air flow. This helps to ensure that the heat is being dissipated quickly and efficiently. Additionally, the solderable pins allow the heat sink to be attached securely to the device, thus providing optimal cooling performance.
The ATS-20E-59-C1-R0 thermal - heat sink is an integral part of any electronic device or component. The heat sink provides optimal performance by absorbing heat and dissipating it away from the device, thus increasing the longevity and reliability of that device or component. Additionally, its extruded aluminum construction and fin cooling technology ensure optimal cooling performance, while its solderable pins allow for secure mounting. The ATS-20E-59-C1-R0 thermal - heat sink is an essential component for any electronic device or component, and it can be used to optimize the performance and reliability of those components.
The specific data is subject to PDF, and the above content is for reference