| Allicdata Part #: | ATS-20E-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-20E-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A thermal heat sink, also known as a cooling fin or heat spreader, is a device that dissipates excess heat, usually generated by electronic components such as computers and microprocessors, by absorbing and spreading the heat over a large area. Heat sinks are commonly used in electronics and computing applications to maintain a stable temperature and thus reduce the risk of heat damage. One particular type of thermal heat sink is the ATS-20E-63-C3-R0.
The ATS-20E-63-C3-R0 is a thermal heat sink specifically designed to be used in higher-end applications that require enhanced thermal performance. It is a radial flow heat sink with an extended blade design, allowing for superior cooling compared to its predecessors. The fins on the heat sink are made of anodized aluminum alloy, making it durable and able to dissipate heat efficiently. The ATS-20E-63-C3-R0 also features a stamped cast-in cover, which helps to improve performance and provide optimal thermal protection.
The primary application field for the ATS-20E-63-C3-R0 thermal heat sink is in components and devices that require a higher level of thermal performance, such as those used in high-powered computer processors and other high heat generation components. This heat sink can also be used in applications where a large heat spreader is required, such as ultra-small form factor cooling systems or to increase thermal performance in various other devices.
The working principle of the ATS-20E-63-C3-R0 thermal heat sink is based on the principle of convection. Heat is generated by the components to which the heat sink is connected and transferred to the fins of the heat sink. The fins then dissipate the heat into the surrounding environment via convection, meaning the air around the heat sink absorbs and carries away the heat.
The higher the temperature of the components, the more heat is dispersed into the fins and then into the air around the heat sink. The ATS-20E-63-C3-R0 is designed in such a way that the fins spread out the heat, ensuring maximum efficiency in terms of temperatures. This type of heat sink is also popular because of its ability to dissipate heat quickly, making it ideal for applications that require fast dissipation of heat.
The ATS-20E-63-C3-R0 thermal heat sink is an ideal solution for applications that require superior thermal protection and performance. It is a reliable and cost-effective solution to help dissipate high levels of heat quickly and safely, and is widely used in high-end electronics and computing applications. The advanced fin design ensures maximum heat dissipation, making it a highly effective and efficient option for thermal management.
The specific data is subject to PDF, and the above content is for reference