ATS-20E-75-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20E-75-C3-R0-ND

Manufacturer Part#:

ATS-20E-75-C3-R0

Price: $ 3.44
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20E-75-C3-R0 datasheetATS-20E-75-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.12669
30 +: $ 3.04206
50 +: $ 2.87305
100 +: $ 2.70409
250 +: $ 2.53507
500 +: $ 2.45056
1000 +: $ 2.19705
Stock 1000Can Ship Immediately
$ 3.44
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.29°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-20E-75-C3-R0 is a thermal-heat sink device. Heat sinks are important components in many applications, providing the ability to effectively dissipate heat away from sensitive components, reducing the risk of damage caused by an operational environment that is too hot. In the case of the ATS-20E-75-C3-R0, this device is a natural convection type, meaning it utilizes air as the cooling medium, as opposed to other methods such as forced-air cooling or liquid cooling.

The cooling effect provided by the ATS-20E-75-C3-R0 heat sink is achieved through the process of natural convection. This occurs when air, which is a relatively good conductor of heat, is heated and rises, and then replaced by cooler air which causes the heated air to continue rising. This continual swapping of air, with the hottest air constantly rising and the cooler air being drawn in to take its place, causes the air to circulate around the heated component, providing the cooling effect.

The ATS-20E-75-C3-R0 utilizes the natural convection process to maintain the temperature of a component. This is done by the heat sink absorbing the heat from the component, transferring it to the fins of the heat sink, which act as a large heat-dissipating surface area. The fin surface of the heat sink is exposed to the surrounding air which is then heated up, as it rises, the cooler air is drawn into the base of the heat sink, providing a cyclic cooling effect.

The air intake at the base of the ATS-20E-75-C3-R0 heat sink is designed to be of a specific size relative to the size of the heat sink. This allows it to ensure that a sufficient amount of air is in continuous contact with the heat sink in order to properly dissipate the heat. The size of the air intake, as well as the number of fins, can be adjusted to optimize the performance of the heat sink.

The ATS-20E-75-C3-R0 heat sink is used in a wide variety of applications, because it is a very versatile cooling device. It can be used in applications where a large heat load needs to be dissipated, such as industrial automation equipment, lighting, computing, telecommunications, medical instrumentation, LED displays and automotive components.

The ATS-20E-75-C3-R0 is a reliable and efficient heat sink device which can be used in many applications, providing effective heat dissipation. Its flexible design and relative compactness make it ideal for use in many different types of environments, allowing it to be tailored to the needs of the particular application.

The specific data is subject to PDF, and the above content is for reference

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