| Allicdata Part #: | ATS-20E-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-20E-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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ATS-20E-80-C1-R0 Thermal - Heat Sinks Application Field and Working Principle
Heat sink is a device which can transfer heat away from one device to another. Heat sinks are broadly used in the majority of applications where a device needs to be cooled. It is an important part of the durable and secure operation of the equipment. It is usually made from a thermally conductive material with a patterned surface area to enable dissipating the heat away from the device and into a surrounding environment or another device. The ATS-20E-80-C1-R0 Heat Sink is an ideal product for the purpose of cooling.
The ATS-20E-80-C1-R0 heat sink is made of aluminum-air-mix material. It has been designed to provide an effective and efficient thermal conduction by allowing air to pass through its channels. Its construction procedure is controlled and check for uniformity, assuring reliable performance and product quality assurance. The fins of the heat sink aid in heat dissipation to help keeping the device temperature at a desirable level. The heat sink is a monolithic structure, meaning that the constructional material is integrated together, not separate parts which would be assembled to form a single product. This allows the heat sink to handle a variety of operating conditions, including high temperatures, for long-term usage.
The ATS-20E-80-C1-R0 Heat Sink can be attached to the device in various ways. It is important to use the correct mounting technique based on the design of the application and the device requirements. The heat sink may be able to be mounted directly to the device or it may require the addition of a mounting bracket or board. The thermal contact between the heat sink and the device can be enhanced with the addition of thermal interface materials such as thermal paste, thermal compound, and thermal tape.
The working principle of the ATS-20E-80-C1-R0 Heat Sink is fairly simple. The heat generated by the device is transferred by conduction through the material of the heat sink to the fins, which dissipate the heat away as hot air by pushing it through the channels of the heat sink. The air expelled from the channels also allows cooler air to enter the heat sink which will be used to cool the device down again. The heat sink material, fin shape and height are designed to provide the greatest heat dissipation for each individual application.
The ATS-20E-80-C1-R0 Heat Sink is an ideal choice for applications that expect continual and consistent heating; for example, in Laser diodes, Power supplies, LED drives, Embedded systems, and many other fields. The Heat Sink can also be applied in situations where cooling is necessary for quick and temporary circumstances for example in automotive electronics and in surge or over-load protection.
The ATS-20E-80-C1-R0 Heat Sink provides an efficient and reliable solution for any application where thermal transfer and dissipation is important. The heat sink is easy to install and maintain, making it a perfect choice for a wide range of applications with different working conditions.
The specific data is subject to PDF, and the above content is for reference
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