| Allicdata Part #: | ATS-20E-89-C1-R0-ND |
| Manufacturer Part#: |
ATS-20E-89-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-89-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal technology is a critical component of modern technology, and heat sinks are among the most important components. Heat sinks are specially designed to dissipate or transfer warmth away from specific parts of a system or equipment. Heat sinks are generally connected to the necessary components, and are often manufactured with precision to enable effective heat dissipation. The ATS-20E-89-C1-R0 heat sink is one of the most widely used models in the industry today. It is a very versatile device, and is often used in a variety of applications due to its excellent performance in dissipating heat.
The ATS-20E-89-C1-R0 Application Field and Working Principle
The ATS-20E-89-C1-R0 heat sink is designed to dissipate heat from computer processors and other related components. It is a great choice for a variety of situations, due to its large surface area and effective heat dissipation capabilities. ATS-20E-89-C1-R0 can be connected to any kind of processor, and is compatible with multiple operating systems. Its easy installation and configuration makes it a great choice for systems with limited space.
The ATS-20E-89-C1-R0 heat sink utilizes an internal fins system that is designed to increase air circulation and cooling efficiency. The surface of the fins is designed with holes and grooves to increase thermal contact area and reduce the transfer of heat from the CPU to the air. This increases cooling performance while reducing the impact of hot spots. The heat sink also features a low profile design, which allows the device to fit into tight spaces and provides an improved cooling solution.
The ATS-20E-89-C1-R0 heat sink also utilizes a fan (optional) which helps keep the heat transfer from the system to the environment low, thus reducing noise. The fan is usually installed within a heat sink to provide a cooling solution for the processor. The fan generates a cooling breeze to help keep the processor cool and provide a more energy efficient solution. The fan also ensures that the temperature of the CPU stays within the acceptable range.
The ATS-20E-89-C1-R0 heat sink also utilizes a two-plane design to maximize the thermal dissipation performance of the device. The design includes two layers of metal fins which act as a barrier between the processor and the air. This results in a more effective transfer of heat from the processor to the environment. The two-plane design also allows for more efficient heat distribution, which further improves the cooling performance of the device.
The ATS-20E-89-C1-R0 heat sink is a highly versatile device, and is used in a wide range of applications due to its excellent performance in dissipating heat. It is particularly well-suited for applications where space is limited, and its low profile design makes it perfect for small form factor systems. The ATS-20E-89-C1-R0 is ideal for gaming PCs, server racks, and portable devices, and its easy installation and configuration make it a great choice for systems that are constantly in use.
The specific data is subject to PDF, and the above content is for reference