| Allicdata Part #: | ATS-20E-91-C3-R0-ND |
| Manufacturer Part#: |
ATS-20E-91-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20E-91-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are becoming increasingly important in modern electronics applications. Heat sinks and other such components are essential for dissipating heat to ensure reliability of electronic components. The ATS-20E-91-C3-R0 is a high performance thermal solution from American Microsystems for applications such as heat dissipation, to ensure maximum performance and reliability.
The ATS-20E-91-C3-R0 is a combination of metal fins and ceramic cartridges, where the metal fins are designed to dissipate heat over a large surface area. The ceramic cartridges consist of a metal heatsink backed by a ceramic sleeve for increased dissipation area. The ceramic cartridges come with a built-in air deflector, for increased air flow to the heatsink area. The ATS-20E-91-C3-R0 also features specially designed supports for the metal fins, which further increase air flow and maximize cooling performance.
The ATS-20E-91-C3-R0 is designed with excellent thermal characteristics, to improve the cooling performance of electronic components. The metal fin surface area is designed to provide maximum heat dissipation, with no compromise in size or weight. The ceramic cartridges further enhance the thermal efficiency of the ATS-20E-91-C3-R0, with the added air flow of the built-in air deflector.
The ATS-20E-91-C3-R0 application field includes power supply systems, thermal management for electronic components and other demanding applications. It has been designed for use with multiple thermal power profiles, including forced-air, natural convection, CPU/GPU, and thermoelectric cooling. It can also be used in automotive, military, medical, and telecom applications.
In terms of working principle, the ATS-20E-91-C3-R0 uses two key thermal principles for cooling. The first is a conductive cooling system, which works through the application of heat from the component to the metal fin surface area, and subsequent dissipation of that heat into the air. This effectively pulls heat away from the component and releases it into the air on the metal fins, resulting in a cool running system. The second principle employed by the ATS-20E-91-C3-R0 is a convective cooling system, which works by using the built-in air deflectors to channel air around the fins and actively dissipate heat away from the component.
In conclusion, the ATS-20E-91-C3-R0 is an excellent thermal solution from American Microsystems for applications such as heat dissipation, to ensure maximum performance and reliability. The combination of metal fins and ceramic cartridges, combined with the built-in air deflectors, allows for effective conductive and convective cooling of electronic components. It has been designed for use with multiple thermal power profiles, and can be used in automotive, military, medical, and telecom applications.
The specific data is subject to PDF, and the above content is for reference