| Allicdata Part #: | ATS-20F-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-20F-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-20F-116-C3-R0 Application Field and Working Principle
ATS-20F-116-C3-R0 is a heat sink that is designed to dissipate heat from electronic components, such as CPUs, power supplies, and LED drivers. It is a specific series of the ATS product line, manufactured and distributed by Kaarun Company Ltd.
Introduction: Heat sinks provide an efficient way to cool high-power components and devices. Heat sinks are usually made from aluminum or copper, and the number and size of the fins they contain decides their cooling capacity. ATS-20F-116-C3-R0 is a heat sink, with a specific design and performance, dedicated to providing efficient disspeation of heat from CPUs, power supplies, and LED drivers.
Field of Application: This heat sink is mainly used to cool down CPUs, power supplies, and LED drivers. It is ideal for applications involving high-powered components with fast switching times, which require cooler working environments for improved performance. It is also capable of cooling multiple components at the same time, as it can be mounted onto a heatsink array.
Working Principle: The ATS-20F-116-C3-R0 heat sink works by transferring heat from the components to the surface of the heat sink, which rapidly dissipates it to the surrounding environment. This is achieved by increasing the total surface area of the heat sink, which is why it is made up of several fins, as heat transfers faster throughout a larger surface area than it would a smaller surface area. Heat is then dissipated to the environment through convection. The more efficient cooling capacity, the better the performance and the more reliable the component.
Advantages: The ATS-20F-116-C3-R0 provides several advantages over other heat sinks. It is made of aluminum, making it lightweight and easy to install. Additionally, its fins ensure a rapid cooling of the components and are also capable of cooling multiple components simultaneously. It is also durable, stable, and highly compatible with many CPUs, power supplies, and LED drivers.
Conclusion: The ATS-20F-116-C3-R0 heat sink is an efficient and reliable cooling solution for CPUs, power supplies, and LED drivers. Its aluminum fins and lightweight design ensure a rapid dissipation of heat, while its durability and compatibility with many components make it an ideal choice for many cooling applications.
The specific data is subject to PDF, and the above content is for reference