| Allicdata Part #: | ATS-20F-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-20F-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are components used in electronics to dissipate the heat generated by a device or system when it is in operation. The ATS-20F-117-C1-R0 is a low profile heat sink designed to reduce temperature rise in high ambient temperature conditions. It offers superior performance with a low thermal resistance, which ensures excellent heat dissipation for improved performance.
The ATS-20F-117-C1-R0 can be used in a variety of applications, ranging from compute power, lasers, I/O controllers, drives, and memory modules. Its design is compact and lightweight, which makes it ideal for mounting into limited space applications. Its low profile design also makes it suitable for use with processors, which require low thermal resistance.
The ATS-20F-117-C1-R0 is designed to ensure a proper cooling solution while delivering excellent thermal performance. It features a high-performance aluminum heat spreader that ensures uniform heat dissipation. It is also furnished with round metal fins to help spread heat away from the hot spot. Additionally, its innovative design allows it to fit into limited space requirements.
The ATS-20F-117-C1-R0 is designed to provide a reliable cooling solution that is both effective and efficient. Its aluminum heat spreader provides superior thermal performance while helping to ensure low power consumption. Additionally, its low profile design ensures a high degree of stability and keeps components cool even under the most demanding conditions.
The ATS-20F-117-C1-R0 thermally efficient design also allows it to be used in applications with high thermal requirements. Its high thermal resistance ensures that the device can handle a wide range of temperatures without compromising its performance. Additionally, its unique design allows it to fit into tight spaces and makes it suitable for use with processors that require low thermal resistance.
The ATS-20F-117-C1-R0 is an ideal choice for applications that require a low profile heat sink that provides excellent heat dissipation. Its low thermal resistance ensures excellent heat transfer even in high ambient temperature conditions. It is an ideal choice for applications that require a reliable and efficient cooling solution. Furthermore, its low profile design helps to ensure that components stay cool even under the most stringent conditions.
The specific data is subject to PDF, and the above content is for reference