ATS-20F-122-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20F-122-C3-R0-ND

Manufacturer Part#:

ATS-20F-122-C3-R0

Price: $ 3.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20F-122-C3-R0 datasheetATS-20F-122-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.49524
30 +: $ 3.40074
50 +: $ 3.21174
100 +: $ 3.02280
250 +: $ 2.83387
500 +: $ 2.73940
1000 +: $ 2.45602
Stock 1000Can Ship Immediately
$ 3.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.95°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-20F-122-C3-R0 thermal heat sink is a product from Advanced Thermal Solutions, Inc. that is designed to provide efficient thermal management for electronic components in various applications. The ATS-20F-122-C3-R0 is a two-piece, copper-fabricated heat sink designed to dissipate large amounts of heat generated from electronic devices. The thermal heat sink provides a direct mounting solution with an integrated thermal interface material (TIM), an effective airflow design, and a highly efficient thermal dissipation capability.

The ATS-20F-122-C3-R0 is designed for efficient heat dissipation in several different applications. This heat sink is ideal for medium-power applications such as communications equipment, medical equipment, computing & networking, and industrial control. It is also suitable for applications that require high-power coping, such as high-frequency amplifiers, frequency synthesizers, solid-state lasers, and power supplies.

The ATS-20F-122-C3-R0 is also notable for its simple installation process. It utilizes direct-mounting technology that eliminates the need for complex mounting hardware. This allows the heat sink to be easily mounted and adjusted in tight spaces. Furthermore, the heat sink can be detached with just one screw.

To ensure the highest levels of performance, the ATS-20F-122-C3-R0 comes equipped with an integrated thermal interface material (TIM). This material has a high thermal conductivity and an effective air flow design, which provide efficient heat dissipation. The TIM also provides a substantial gap between the heat source and the heat sink to ensure optimum thermal performance.

In addition, the ATS-20F-122-C3-R0 is designed for long-term durability. Its two-piece construction features a copper-coated base and a top surface made from highly durable aluminum alloy. The top layer is also coated with white fluorinated polymer (FEP), which helps protect the surface from nicks and scratches. The heat sink\'s simple, space-saving design makes it ideal for use in confined spaces.

The ATS-20F-122-C3-R0 offers outstanding performance and reliable cooling for applications that generate large amounts of heat. The combination of its direct-mounting technology, integrated TIM, and efficient air flow design make it one of the most effective thermal management solutions available. The heat sink\'s high-durability construction ensures long-term reliability, while its simple installation process makes it suitable for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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