| Allicdata Part #: | ATS-20F-128-C3-R0-ND |
| Manufacturer Part#: |
ATS-20F-128-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-128-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are devices that are used to effectively dissipate heat away from a component while still maintaining the structural and electrical integrity of the component. The ATS-20F-128-C3-R0 is a particular thermal heat sink solution that is made from a thermally conductive aluminum alloy. This heat sink is designed for a variety of applications and is available in various sizes and packages, allowing it to be used in a variety of environments and applications.
The ATS-20F-128-C3-R0 heat sink features a clip-on mounting system that makes installation easy. The heat sink also includes pins that are deployed on the surface that match the electronic components and provide the necessary contact for a secure fit. The shape of the heat sink includes long fins that extend internally into the component and provide additional heat dissipation surfaces.
The primary application of the ATS-20F-128-C3-R0 thermal heat sink is for the cooling of electronic components. These components are usually operating at higher temperatures and need extra heat dissipation to ensure that they do not get too hot and cause system failure. This is especially true in applications where the component is placed in a confined space where cooling airflow is limited.
The working principle of the ATS-20F-128-C3-R0 heat sink is based on thermodynamics. Heat generated by the electronic components is transferred by either conduction or convection and is dissipated through the heat sink material. As the heat is dissipated, the air around the heat sink absorbs the heat and takes it away from the component, reducing the overall temperature of the component. The fins of the heat sink act as an extension of the heat dissipation surface, which aids in increasing overall heat dissipation capacity.
The ATS-20F-128-C3-R0 thermal heat sink is designed to be used in a variety of applications including but not limited to, power supplies, networking systems, and automotive electronics. Additionally, this particular heat sink is rated to handle up to 128 watts of power, making it ideal for use in high wattage applications. The compact size and clip-on mounting system make installation easy and minimize the chances of system failure due to incorrect installation.
The ATS-20F-128-C3-R0 heat sink is an ideal solution for any application where an effective and efficient thermal heat sink is needed. The robust construction and design of the heat sink make it a reliable and long-lasting choice for many applications. The heat sink is made of a thermally conductive aluminum alloy and features pins that are deployed for secure component contact. The long fins provide additional heat dissipation surfaces, and the clip-on mounting system simplifies installation and ensures the correct placement of the heat sink. This heat sink is rated to handle up to 128 watts of power and is capable of handling a variety of applications without system failure.
The specific data is subject to PDF, and the above content is for reference