| Allicdata Part #: | ATS33774-ND |
| Manufacturer Part#: |
ATS-20F-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are a type of thermal management product that can be used for dissipating heat generated by electronic components and help regulate the internal temperatures. The ATS-20F-134-C2-R0 is a particularly high-performance heat sink that is used for reducing high temperatures from even high-powered components.
ATS-20F-134-C2-R0 is a high-performance heat sink that is designed with a convectional method to prevent temperatures from reaching high levels. This method employs the circulation of air, using a fan, to draw heat away from CPU-intensive components. The air is then cycled between the heat sink and the component(s) to create a cooling process.
In addition to its convection method, the ATS-20F-134-C2-R0 also utilizes fins to help dissipate the heat even more efficiently. The fin design maximizes the air circulation that is needed to create a cooling effect, and also reduces the thermal resistance and increases the surface area to help dissipate the heat.
The ATS-20F-134-C2-R0 is also designed with an increased range of power dissipation rate, increasing the thermal management capabilities. The power dissipation rate is basically the amount of heat that can be transferred from the source to the thermal management product. With a higher rate, this heat sink is able to provide superior cooling to components with plenty of heat.
This heat sink can also be customized to fit various components and applications. Different mounting methods, such as clip-on or adhesive mounting, can be used to secure the heat sink to the component. This helps ensure that the heat sink will stay firmly in place and will not be easily damaged due to vibration or jarring movement.
The ATS-20F-134-C2-R0 is an incredibly versatile product that can be used to cool a variety of components, making it ideal for applications ranging from industrial, medical, and military, to automotive, consumer, and telecom. Thanks to its high-performance design, the ATS-20F-134-C2-R0 is able to provide superior cooling, even during intense temperature conditions.
The specific data is subject to PDF, and the above content is for reference