| Allicdata Part #: | ATS-20F-171-C1-R0-ND |
| Manufacturer Part#: |
ATS-20F-171-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-171-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices designed to dissipate thermal energy from electronic components or systems. The ATS-20F-171-C1-R0 thermal heat sink is one of the most popular choices among engineers due to its robust design and efficient cooling capabilities. This article will explore the different applications and working principles of this heat sink.
The ATS-20F-171-C1-R0 thermal heat sink is a fanless solution, which makes it perfect for low-profile applications that require minimal height. The heat sink is constructed from high-grade aluminum which has excellent thermal conductivity. The large surface area of this particular heat sink also helps in cooling as large heat-producing components.
The ATS-20F-171-C1-R0 thermal heat sink is designed with an advanced thermal management system that allows it to move heat away from components more efficiently. This heat sink is made up of fins that are designed in a saw-tooth pattern to increase the surface area available for heat transfer. The fins are arranged in such a way that air can flow in between them, allowing for a more efficient transfer of heat. The fins are also made of high-grade aluminum which increases their ability to transfer heat away from components.
The ATS-20F-171-C1-R0 thermal heat sink is designed to be used in a variety of applications. It is ideal for microprocessors, motor drivers, power supply ASICs, digital signal processors, and other high powered components. This type of heat sink can also be used for cooling and air-conditioning applications in data centers and server rooms. In addition, this type of heat sink can be used for server and storage systems, as well as for audio and video equipment.
The working principle of this heat sink is simple. As the component produces heat, the fins create a flow of hot air over the component which absorbs the heat and releases it outside the system. The hot air is then replaced by fresh air from outside the system. This process continues until all the heat has been dissipated, leaving the system in a safe temperature range.
The ATS-20F-171-C1-R0 thermal heat sink is a popular choice for many engineers and is suitable for a variety of applications. Its advanced thermal management system and efficient cooling capabilities make it a great choice for cooling high powered components. Moreover, this type of heat sink is a reliable solution for cooling air-conditioning applications in server rooms and data centers, as well as audio and video equipment. This heat sink is an ideal choice for those looking for a reliable and effective way to manage heat in their electronics.
The specific data is subject to PDF, and the above content is for reference