ATS-20F-193-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20F-193-C1-R0-ND

Manufacturer Part#:

ATS-20F-193-C1-R0

Price: $ 3.02
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X6MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20F-193-C1-R0 datasheetATS-20F-193-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.72223
30 +: $ 2.64873
50 +: $ 2.50160
100 +: $ 2.35450
250 +: $ 2.20735
500 +: $ 2.13376
1000 +: $ 1.91302
Stock 1000Can Ship Immediately
$ 3.02
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.05°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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There is a wide range of applications for Thermal - Heat Sinks, and the ATS-20F-193-C1-R0 is an example of a heat sink that is frequently used in electronics applications. This article will take a look at the different applications of the ATS-20F-193-C1-R0, as well as explain its working principle.

Applications for ATS-20F-193-C1-R0

The ATS-20F-193-C1-R0 is a heat sink designed for cooling applications. It is designed to provide thermal protection against the high temperatures that can occur when operating electronic components. The heat sink is commonly used in many industries, including medical, automotive, industrial, aerospace, telecom, and computer manufacturing. It can also be used in a variety of applications, such as cooling of integrated circuits, transistors, voltage regulators, and other semiconductor devices. Additionally, the heat sink is effective in providing cooling for computer processors, memory, and other high-end components.

Design and Construction of ATS-20F-193-C1-R0

The ATS-20F-193-C1-R0 is constructed of a copper-clad aluminum heat spreader and a black anodized aluminum heat sink. The heat spreader is designed to provide maximum thermal conductivity, while the aluminum heat sink is designed to provide high levels of heat conduction. Additionally, the heat sink is designed to resist wear and tear, and is also resistant to corrosion.

Working Principle of ATS-20F-193-C1-R0

The ATS-20F-193-C1-R0 is designed to dissipate heat by utilizing the heat spreader and heat sink combination. The heat spreader is designed to conduct heat away from the component, while the aluminum heat sink acts to reduce the temperature of the component. Heat is then conducted away from the component via a series of fins, which are designed to increase the surface area for heat dissipation. The fins allow for increased convection, which leads to increased thermal efficiency. The heat sink is designed such that the temperature of the component is kept below its maximum operating temperature. This helps to extend the life of the component and maintain its functionality.

Conclusion

The ATS-20F-193-C1-R0 is a heat sink designed to provide cooling for a wide range of applications. It is constructed of a copper-clad aluminum heat spreader and a black anodized aluminum heat sink, and is effective in dissipating heat away from components. Additionally, the working principle of the heat sink is designed to reduce the temperature of components and extend their life. The ATS-20F-193-C1-R0 is a reliable and effective heat sink that is used widely throughout the electronics industry.

The specific data is subject to PDF, and the above content is for reference

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