ATS-20F-200-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.90°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Temperature & Heat Sinks: ATS-20F-200-C3-R0 Application Field and Working Principle

Temperature and heat sinks are an important component of many electronic systems. They are designed to regulate temperatures and keep the components of the system safe and stable. ATS-20F-200-C3-R0 is a heat sink product offering from Aavid Thermacore. In this article we will explore the application field and working principle of this product.

Application Field of ATS-20F-200-C3-R0

ATS-20F-200-C3-R0 is a small size, round profile of heat sink, made using extrusion technology, that can be used in many industrial and commercial applications. It is suitable for applications like Telecom and server, industrial and automotive, energy storage, consumer electronics, power supply, RF device, and aerospace & aviation.In terms of applications, this product is designed to work best in scenarios where the total power dissipation for the system is more than 50W, with an ambient temperature of -50°C to 50°C and an air-to-gas convection cooling flow rate of 0.68m/s.

Working Principle of ATS-20F-200-C3-R0

The working principle of ATS-20F-200-C3-R0 is based on exchanging heat between two mediums, usually air and a solid, such as aluminum. The heat sink design in this instance models a number of small “fins” or “ribs” on the surface of the aluminum material to create increased surface area for the transfer of heat. These fins (or ribs) are designed with precise dimensions and spacing to efficiently direct and dissipate the heat away from the aluminum.Heat is released as conduction from the base of the product to the fins and released by convection to the air. Aavid Thermacore\'s innovative fin design ensures a maximum amount of heat is transferred from the base to the fins and then to ambient air. The use of this product as a cooling solution gains increased efficiency as the thermal conduction of aluminum is 8x greater than that of conventional plastic heat sinks.

Conclusion

The ATS-20F-200-C3-R0 is a great heat sink product from Aavid Thermacore, suitable for many industrial and commercial systems in need of high quality heat regulation. Its application field is perfect for SMD and BGA devices with high power dissipation levels, and its proven working principle efficiently transfers heat from the base to the fins, and then to the air. This makes the product an excellent choice for any situation where high performance cooling is required.

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