| Allicdata Part #: | ATS33861-ND |
| Manufacturer Part#: |
ATS-20F-24-C2-R0 |
| Price: | $ 5.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-20F-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are critical components in electronics, providing a way for heat generated by electronic components to dissipate. The ATS-20F-24-C2-R0 is a type of thermal heat sink that has numerous applications and uses a specific working principle.
In terms of design, the ATS-20F-24-C2-R0 is a finned, aluminum heat sink that includes a mounting bracket and steel clips. It measures just 180mm x 80mm x 42mm in total and weighs 600g. In other words, it is quite compact, which makes it ideal for many electronic applications.
The primary application of the ATS-20F-24-C2-R0 is to cool electronic components, such as microprocessors and voltage controllers. Due to its compact size and relatively low weight, it can be utilized in tight spaces, such as inside computers, servers, and other types of electronic equipment. Additionally, the mounted clips are designed to efficiently dissipate heat and provide better cooling.
In terms of its working principle, the ATS-20F-24-C2-R0 is designed so that air enters from the side, passes over the finned structure and is exhausted at the bottom. The heat generated by the components is dissipated by this air flow. Furthermore, the design of the fin also helps to maximise the surface area that is exposed to the air and, hence, the heat generated by the components.
Aside from cooling components, the ATS-20F-24-C2-R0 is also commonly used for dissipating heat generated by electric motors and lighting fixtures. Additionally, it can be used for cooling other electronic components, such as switches, capacitors, and other components that generate heat. Lastly, it can be used to cool telecom systems and to provide additional cooling to plasmonic components.
In summary, the ATS-20F-24-C2-R0 is a type of finned, aluminum heat sink that is designed to efficiently dissipate heat generated by electronic components. Due to its low weight and small size, it is ideal for use in tight spaces, such as inside computers and other electronic equipment. Heat is dissipated through air passing over the finned structure and being exhausted at the bottom. The ATS-20F-24-C2-R0 can be used for cooling microprocessors, voltage controllers, electric motors, lighting fixtures, switches, capacitors, telecom systems, and plasmonic components.
The specific data is subject to PDF, and the above content is for reference
ATS-20F-24-C2-R0 Datasheet/PDF