| Allicdata Part #: | ATS-20F-38-C2-R0-ND |
| Manufacturer Part#: |
ATS-20F-38-C2-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-38-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.52888 |
| 30 +: | $ 5.22186 |
| 50 +: | $ 4.91463 |
| 100 +: | $ 4.60744 |
| 250 +: | $ 4.30028 |
| 500 +: | $ 3.99312 |
| 1000 +: | $ 3.91632 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks have become a staple in many electronic applications. However, selecting the best heat sink for a given application can be tricky. This is why it is important to understand the application field and working principle of the heat sink. The ATS-20F-38-C2-R0 is a heat sink that is designed for a variety of applications and is capable of dissipating large amounts of heat.
The ATS-20F-38-C2-R0 is designed specifically for cooling applications. It is designed to be used in high-power industrial applications, such as power electronics, server applications, medical equipment, and more. This heat sink features a base made of extruded aluminum with a fin structure that is designed to maximize heat dissipation. The ATS-20F-38-C2-R0 has a rated power consumption of 500 watts, and it is capable of dissipating large amounts of heat in a small package.
The working principle of the ATS-20F-38-C2-R0 is simple. Heat-generating components within an electronic device create hot surfaces, which are highly thermally conductive. The ATS-20F-38-C2-R0 utilizes the thermal conductivity of the aluminum base and the fin structure to dissipate the heat away from the components. The fins act as miniature radiators, allowing the hot surfaces to dissipate heat into the surrounding air. The air is then drawn away from the heat sink, carrying the heat with it.
In addition, as the heat generated by the components rises, the fins absorb the heat and transfer it into the surrounding air. This transfer process requires a great deal of air flow, which is why it is important to ensure that the area around the heat sink is sufficiently ventilated. In this manner, heat is removed from the components, thus maintaining their temperature at a safe level and preventing them from overheating.
The ATS-20F-38-C2-R0 is a highly efficient heat sink that is ideal for applications that require high thermal dissipation rates in a small space. This heat sink is capable of dissipating large amounts of heat in a short amount of time, making it an excellent choice for cooling of high-power electronic applications. As such, it can be used in a wide variety of applications, including power electronics, server applications, medical equipment, and more.
The specific data is subject to PDF, and the above content is for reference