ATS-20F-48-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-Heat Sinks are an integral element in the design and operation of any electrical or electronic device or system. An effective electrical heat sink dissipates heat quickly and safely from components. The ATS-20F-48-C3-R0 Thermal-Heat Sink is a popular choice for electrical and electronic device applications. This article discusses the application areas and working principles of the ATS-20F-48-C3-R0 Thermal-Heat sink.

The ATS-20F-48-C3-R0 Thermal-Heat Sink is a high-performance thermal management solution designed to offer the best possible thermal performance for consistent performance and reliability. The ATS-20F-48-C3-R0 is designed to dissipate heat quickly and effectively in high-density electronic applications. This heat sink offers a rectangular profile that allows for mounting of various types of components and systems in a compact package.

It is widely used in the aerospace and defense, automotive, and in numerous electronic products such as medical devices, networking products, consumer electronics, and telecommunications products. ATS-20F-48-C3-R0 is ideal for applications where space is limited due to its low profile design, and its high quality construction ensures high performance over time.

The ATS-20F-48-C3-R0 is constructed from aluminum alloy and designed to meet the requirements of MIL- 810G governing thermal shock and vibration qualifications. This material provides excellent thermal conductivity for efficient heat dissipation and thermal expansion resistance. The ATS-20F-48-C3-R0 also has variable fin frequencies and variable fin heights, so it can be customized to fit virtually any heat management needs.

The ATS-20F-48-C3-R0 also offers a unique heat spreader technology that allows for rapid heat transfer away from components that produce more heat than other devices. This allows for efficient cooling and prevents damage to components due to overheating. This technology also provides superior airflow characteristics, which enhance cooling abilities.

The ATS-20F-48-C3-R0’s operating principles are based on its construction and materials. The aluminum alloy construction of the ATS-20F-48-C3-R0 serves as an excellent heat conductor and is designed to promote rapid heat transfer away from components and devices. The unique heat spreader technology allows for efficient heat dissipation away from components, while the thermal expansion resistance and variable fin frequencies enhance cooling capabilities.

When operating, the ATS-20F-48-C3-R0 draws in air from its surroundings and then spreads it across the heatsink fins. This air then absorbs the heat generated by the components. The fins then dissipate the heat away from the component. This is a very efficient way of preventing component damage from overheating. The size of the heat sink and the number of fins also play a part in the heat dissipation process.

The ATS-20F-48-C3-R0 Thermal-Heat Sink is a great choice for any application that requires an efficient and reliable thermal management solution. This heat sink offers superior thermal performance in high-density electronic and aerospace applications. It is well-suited for high-performing components that require rapid heat dissipation in a compact size. The variable fin frequencies and design allow for easy customization to many applications. The operating principles and materials used ensure long-term reliability.

The specific data is subject to PDF, and the above content is for reference