| Allicdata Part #: | ATS-20F-58-C3-R0-ND |
| Manufacturer Part#: |
ATS-20F-58-C3-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-58-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.52800 |
| 30 +: | $ 3.33186 |
| 50 +: | $ 3.13589 |
| 100 +: | $ 2.93990 |
| 250 +: | $ 2.74390 |
| 500 +: | $ 2.54791 |
| 1000 +: | $ 2.49892 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component in making sure electronic components, including ATS-20F-58-C3-R0 heat sinks, are protected from the dangers of extreme temperatures. Heat sinks are necessary to prevent components from reaching operating temperatures that can cause permanent damage. ATS-20F-58-C3-R0 heat sinks are designed to reduce the temperature of a component by dissipating the heat in the form of infrared radiation.
Heat sinks are designed to be thermally efficient by relying on a combination of metal surfaces which are usually aluminum or copper to reduce the heat of a component. The metal fins of the ATS-20F-58-C3-R0 heat sink are stacked in layers, with each layer having more fins than the last. This increases the surface area which radiates the heat, allowing the heat to dissipate more efficiently. As the metal fins are heated by the electronic components that are being cooled, they radiate the heat away from the component.
The ATS-20F-58-C3-R0 heat sink is designed for use in various applications from automotive to industrial applications. It is a 40mm square with a height of 15mm, allowing it to fit in areas where space is limited. Additionally, the ATS-20F-58-C3-R0 has a thermal conductivity of 8.5 W/mK, making it one of the most thermally efficient heat sinks on the market. It is also available in a range of different mounting configurations, making it easy to integrate into any system.
The ATS-20F-58-C3-R0 is compatible with a range of different electronic components, including microprocessors, LEDs, and power transistors. The heat sink\'s design allows it to efficiently dissipate the heat generated by these components, reducing their temperature and ensuring that they stay within the acceptable operating range. Furthermore, the aluminum and copper fins of the ATS-20F-58-C3-R0 are treated with a corrosion-resistant coating, making it highly durable even in harsh industrial environments.
In summary, the ATS-20F-58-C3-R0 heat sink is an ideal solution for thermal management in a variety of different applications. Its optimized design ensures maximum efficiency and durability, allowing it to efficiently dissipate heat from electronic components and keep them within the acceptable range of operating temperatures.
The specific data is subject to PDF, and the above content is for reference