| Allicdata Part #: | ATS-20F-59-C1-R0-ND |
| Manufacturer Part#: |
ATS-20F-59-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-59-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management technology has come a long way from its humble beginnings. Heat sinks are now commonplace in a variety of electronic systems, ensuring that the hardware remains sufficiently cooled and operates at optimal performance. ATS-20F-59-C1-R0 is one of the most advanced heat sinks on the market, offering superior thermal performance and reliability. In this article, we delve into the application field and working principle of ATS-20F-59-C1-R0.
Applications of ATS-20F-59-C1-R0
ATS-20F-59-C1-R0 is an extruded aluminum heat sink designed for air-cooled and liquid-cooled systems. It is ideal for applications where space requirements and operating temperatures are critical factors. This heat sink is suitable for applications involving high-power LED lighting, power management ICs, power transistors, IGBTs, and high-speed microprocessors. It has been tested to meet the highest performance requirements, even at the highest operating temperatures.
The ATS-20F-59-C1-R0 features a low-profile design and a patented thermally-enhanced structure for maximum cooling efficiency. Its robust design makes it suitable for both residential and commercial applications. It is also resistant to corrosion, making it a great choice for applications in harsh environments. Additionally, the heat sink is designed with high-grade aluminum alloy for superior durability.
Working Principle of ATS-20F-59-C1-R0
The ATS-20F-59-C1-R0 is designed to efficiently dissipate heat from the electronic components it is installed onto. It works by allowing the warm air layers over the heat sink fins to be released, lowering the ambient temperature. This allows the heat generated by the electronic components to be easily dissipated into the surrounding environment. The result is improved thermal performance and longer component life.
The ATS-20F-59-C1-R0 is designed for ease of installation and maintenance. The modular design allows for easy and quick assembly and replacement. Additionally, the included fan shroud and mounting kit allows for quick setup and ensures that the heat sink is securely attached to its host component.
Conclusion
The ATS-20F-59-C1-R0 is an innovative and reliable heat sink designed for air-cooled and liquid-cooled systems. It is capable of providing superior thermal performance, even at the highest operating temperatures. This heat sink is suitable for a variety of applications, including power management ICs, power transistors, and high-speed microprocessors. With its low-profile design, robust aluminum alloy construction, and efficient cooling performance, this heat sink is an ideal choice for thermal management in both residential and commercial environments.
The specific data is subject to PDF, and the above content is for reference