| Allicdata Part #: | ATS-20F-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-20F-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20F-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor to consider when designing electronic systems. A key component in dissipating heat in a system is the heat sink, which helps to keep the internal components within safe temperature limits. The ATS-20F-65-C3-R0 heat sink is a highly efficient device designed for continuous operation in temperatures up to 105°C. It is suitable for a wide range of applications, from industrial and automotive to medical and military equipment.
The ATS-20F-65-C3-R0 heat sink is designed to support up to 7 Watts of continuous power and dissipate up to 8 Watts of heat depending on its surrounding environment. It is constructed from aluminum alloy with a black powder coating and features a low thermal resistance of 0.21°C/W. The device is lightweight and features a compact design, making it suitable for a variety of applications. It is also designed to provide excellent electrical insulation, with its aluminum alloy material offering excellent corrosion resistance. Additionally, the device features a low profile to ensure optimal movement and air flow in confined spaces.
The working principle of the ATS-20F-65-C3-R0 heat sink is based on the process of conduction. As the internal components of your electronic system heats up, the heat is conducted through the metal structure of the heat sink and dissipates into the surrounding environment. The device is designed with a high thermal capability to maximize the amount of heat dissipated, while its aluminum alloy construction ensures optimal heat transfer. Additionally, the design features a series of fins on the surface of the device, which increases the surface area for heat to be dissipated more quickly.
The ATS-20F-65-C3-R0 heat sink is suitable for a wide range of applications, including medical and military equipment, industrial electronics, and automotive applications. Additionally, the device is designed to be resistant to shock and vibration, making it well suited for mobile applications. The device also features a low profile, making it suitable for use in confined spaces, such as engine compartments in automobiles or other tight spaces in industrial equipment.
The ATS-20F-65-C3-R0 heat sink is an effective and reliable method of dissipating heat in electronic systems. It is lightweight and features a compact design, making it suitable for a variety of applications. Additionally, its aluminum alloy construction provides excellent thermal and electrical insulation, corrosion resistance, and shock and vibration resistance. It is designed to support up to 7 Watts of continuous power and dissipate up to 8 Watts of heat depending on its surrounding environment. With these features, the ATS-20F-65-C3-R0 heat sink is an ideal solution for those looking for effective thermal management in their systems.
The specific data is subject to PDF, and the above content is for reference