| Allicdata Part #: | ATS-20G-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-20G-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for many applications, such as automotive and industrial applications. Heat sinks are designed to dissipate heat generated by parts and components in these applications. In order to do this efficiently, a heat sink must be designed with the right materials and with an efficient structure for maximum cooling capabilities. The ATS-20G-10-C1-R0 Heat Sink is the perfect example of this technology.
The ATS-20G-10-C1-R0 is a heat sink designed specifically for applications with intense thermal loads. It is made of aluminum and is able to transfer heat away from a source component very efficiently. The heat sink\'s design features a large cooling fin surface area, with multiple fins laid out in a staggered pattern for increased airflow and maximum cooling potential. This design is not only efficient, but also highly durable, making it ideal for use in applications with demanding conditions.
The working principle behind the ATS-20G-10-C1-R0 Heat Sink is based on the principle of convective heat transfer. Convective heat transfer is the process of heat transferring from one area to another by means of a fluid (such as air or liquid) moving across a surface. In the case of the ATS-20G-10-C1-R0, heat is drawn away from a source component and transferred to the heat sink via the cooling fins. The fins are designed to increase the amount of air passing through them, creating a larger surface area for the heat to transfer to, thus cooling the component more effectively.
The ATS-20G-10-C1-R0 Heat Sink is suitable for a range of applications. It is especially ideal for applications where heat must be dissipated quickly and efficiently, such as computer processors and power electronics. It is also suitable for applications with smaller areas, due to the design of the fins, which provide optimum performance in tight spaces. Additionally, due to its design, it is also well suited for use in outdoor conditions, as it is highly durable and able to withstand extreme temperatures.
In conclusion, the ATS-20G-10-C1-R0 Heat Sink is a great product for demanding thermal management applications. Its design allows for efficient heat dissipation and is suitable for use in a variety of applications. It is highly efficient and durable, making it an ideal choice for any application where heat management is essential.
The specific data is subject to PDF, and the above content is for reference