ATS-20G-11-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20G-11-C3-R0-ND

Manufacturer Part#:

ATS-20G-11-C3-R0

Price: $ 3.83
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20G-11-C3-R0 datasheetATS-20G-11-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.48138
30 +: $ 3.28818
50 +: $ 3.09481
100 +: $ 2.90134
250 +: $ 2.70791
500 +: $ 2.51449
1000 +: $ 2.46614
Stock 1000Can Ship Immediately
$ 3.83
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks provide efficient cooling solutions in order to protect electronic components from overheating. They are used in a wide range of applications, from consumer electronics components and LED lights to server racks, automotive parts, telecommunications, medical sensors and many more. The ATS-20G-11-C3-R0 is a high-performance heat sink that offers excellent thermal performance in a wide range of applications.

The ATS-20G-11-C3-R0 is designed for use in a variety of applications, including high-power components such as CPUs, GPUs, ASICs, motor controllers, and other power sources. Its advanced design provides superior performance in a variety of applications. The ATS-20G-11-C3-R0 features a highly efficient stacked design, which improves thermal performance and provides low power consumption. The heat sink has coated, flared fins that ensure efficient heat dissipation and provide enhanced airflow. The fins are structured in an open pattern, which helps to increase air circulation and improve cooling efficiency.

The ATS-20G-11-C3-R0 utilizes a copper base, which provides superior thermal conductivity and helps to reduce overall heat transfer. The copper base is machined to precision, and the heat sink contains multiple through-holes that provide greater airflow for increased cooling efficiency. Additionally, the ATS-20G-11-C3-R0 is designed to mount directly to a heat source, such as an integrated circuit board, enabling easy installation.

The ATS-20G-11-C3-R0 is designed to be a cost-effective solution for a variety of applications, including consumer electronics, automotive, and telecommunications. It features a compact design that is easy to install, and its outstanding thermal performance will ensure your components stay cool even under high-usage scenarios. It supports a wide variety of components and operating parameters, and its on-board temperature sensors allow for monitoring of your system’s temperatures in real-time.

The ATS-20G-11-C3-R0 heat sink has a robust structure that is made from high-quality materials, and its long-term reliability is ensured by its durable construction. It is supplied with a full kit of mounting hardware, making it ready for installation when your system is delivered. The ATS-20G-11-C3-R0 is a reliable and cost-effective solution for a wide variety of applications, providing quick and easy cooling solutions.

The specific data is subject to PDF, and the above content is for reference

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