ATS-20G-111-C1-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.362" (60.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.72°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to Thermal - Heat SinksThermal - Heat Sinks are an essential part of electronic cooling. Heat Sinks are used to decrease the temperature of electronic components by removing the heat generated from the components. Heat Sinks are usually constructed of a large surface area of metal, which dissipates the heat into the environment. This helps cool the components and reduces the risk of component damage.Heat Sinks are also used for electro-mechanical applications, such as controlling and distributing heat from motors, etc. Heat Sinks are usually made from either aluminum or copper which are commonly used due to their high thermal conductivity and low price.ATS-20G-111-C1-R1 thermal - heat sink application field and working principleATS-20G-111-C1-R1 is a high-performance thermal - heat sink used for heat-dissipation and cooling of electronic components and systems. The unit is designed with a medium-sized aluminum fin array to ensure effective cooling and low weight. The fins help to dissipate the heat over a large surface area and are connected to the heat-generating components or systems through the use of a metal clip.The unit also features an integrated fan to help pull the hot air out of the device and over the fins. This helps increase the rate of cooling as the hot air is removed more quickly. Additionally, the fins are designed to maximize the surface area exposed to the air stream, while the fan is designed to produce low noise levels.The ATS-20G-111-C1-R1 heat sink is designed for use in a variety of applications, including but not limited to:• High power cooling applications• High-performance laptop computers• Server and telecom applications• Industrial and consumer electronicsThe ATS-20G-111-C1-R1 thermal - heat sink is designed to use an efficient vertical convection design. This design removes the hot air from the device and helps to evenly distribute the heat away from the device. This helps reduce the overall temperature of the device, while also helping to increase the lifespan of the components by reducing their operating temperatures.In conclusion, the ATS-20G-111-C1-R1 heat sink is an ideal solution for effective cooling and heat dissipation in a variety of electronic applications. The fins are designed to maximize surface area exposed to the air stream, while the fan is designed to produce low noise levels. The efficient vertical convection design helps to evenly distribute the heat away from the device, which helps reduce the overall temperature of the device.

The specific data is subject to PDF, and the above content is for reference