| Allicdata Part #: | ATS-20G-115-C3-R0-ND |
| Manufacturer Part#: |
ATS-20G-115-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-115-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in today’s electronics. As devices become smaller and power densities increase, the need for efficient heat dissipation solutions is becoming greater. Heat sinks are essential components in any electronic system and are used to ensure that temperatures remain within established limits. ATS-20G-115-C3-R0 is a thermal-heat sink designed and manufactured by Aavid Thermalloy for the purpose of dissipating heat in hot environments.
The ATS-20G-115-C3-R0 is designed for both commercial and military purposes with specific application fields such as aerospace, transportation, military, renewable energy, and industrial electronics. This thermal-heat sink has a unique design that optimizes cooling and performance. It consists of a two-piece construction featuring an extruded aluminum fin and a copper-base plate. The use of two separate pieces allows for effective heat transfer by efficiently dissipating energy from the hot source to the surrounding environment. Additionally, the extruded fins are optimized to reduce turbulence and allow for large area contact. This increases heat transfer and more effective cooling.
The ATS-20G-115-C3-R0 also contains a built-in fan-in design which helps reduce noise produced by the fan. This is further complemented by thin ribs which are optimized to reduce disturbance from other fans. The heat sink also features a patented thermal back-door which allows separating and controlling the output airflow. This feature helps ensure that the right airflow is directed for each section of the system.
The ATS-20G-115-C3-R0 is also designed for maximum durability and corrosion resistance. It has been tested to perform at temperatures ranging from -40°C to 100°C and up to 175°C for short periods. This makes it an ideal solution for extreme temperatures. In addition, the thermal-heat sink is RoHS compliant and utilizes improved material strength to increase product life.
The working principle of the ATS-20G-115-C3-R0 boils down to the following: Heat is dissipated from a hot surface/source into the environment by convection, which is the transfer of heat through a fluid medium such as air. The two-piece construction of the ATS-20G-115-C3-R0 allows air to flow freely between the fin and the base plate. This air helps transfer heat away from the hot source to the surrounding environment. The built-in fan-in design, thin ribs and thermal back door are utilized to optimize and control the airflow and ensure maximum efficiency.
In summary, the ATS-20G-115-C3-R0 thermal-heat sink from Aavid Thermalloy provides an effective solution for dissipating heat in hot environments. The design of the two-piece structure and the features such as built-in fan-in design, thin ribs and thermal back-door ensure maximum heat dissipation and performance. With its ability to operate in temperatures up to 175°C and its RoHS compliance, the ATS-20G-115-C3-R0 is an ideal choice for any application requiring efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference