| Allicdata Part #: | ATS-20G-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-20G-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of a device is a critical factor in its performance, life, and reliability. Heat Sinks are designed to remove heat from a device, dissipate it, and keep it well within acceptable limits. ATS-20G-117-C1-R0 is a Heat Sink for electronic equipment, specifically designed for small form-factor applications. Its compact size and minimized thermal resistance makes it an ideal choice for a variety of applications.
The ATS-20G-117-C1-R0 Heat Sink is a two-piece thermal solution consisting of a Base and a Top. The Top is made of a high-quality black anodized Aluminum, providing an effective conducting and dissipating surface to transfer heat away from the device. The Base is made from a durable molded thermoplastic enclosure that rests directly on the device and acts as a thermal interface between the device and the Heat Sink. Together, these two pieces provide a high-performance thermal solution that is well-suited for small form-factor devices.
The ATS-20G-117-C1-R0 Heat Sink has an optimized cooling design that maximizes air flow and heat dissipation. The double-stacked fin structure and finned surface provide higher performance than most standard Heat Sinks, resulting in lower thermal resistance and improved thermal performance. The Heat Sink also has internal curvature which directs air flow more efficiently across all surfaces. Additionally, the Heat Sink has a maximum air flow rating of 6.8 cubic meters per minute (CFM), allowing it to handle peak loads with ease and effectiveness.
The ATS-20G-117-C1-R0 Heat Sink is designed to be versatile and easy to install. The Base is designed to fit on a wide range of small form-factor devices, including DC-DC converters, power supplies, memory modules, DSPs, CPUs, LEDs, and other components. The Heat Sink is also easy to install – no additional mounting hardware is necessary, as the mounting holes in the Base fit standard conductor or mounting hole patterns. With its optimized cooling design and easy installation, the ATS-20G-117-C1-R0 Heat Sink is the ideal choice for a variety of electronic applications.
In conclusion, the ATS-20G-117-C1-R0 Heat Sink is a reliable, high-performance Heat Sink suitable for a wide range of small form-factor applications. Its optimized cooling design improves the thermal performance of devices, while its easy installation ensures that the Heat Sink can be quickly and easily installed on any device. With its robust design and versatility, the ATS-20G-117-C1-R0 is the perfect choice for any application that requires reliable and effective thermal management.
The specific data is subject to PDF, and the above content is for reference