| Allicdata Part #: | ATS-20G-124-C3-R0-ND |
| Manufacturer Part#: |
ATS-20G-124-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-124-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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：Thermal - Heat Sinks is one of the most commonly used components for cooling purposes. They are used to absorb, transfer and dissipate heat away from sensitive electronic components in order to keep them from overheating and getting damaged. Among all the available thermal management solutions, one of the most reliable and efficient is the ATS-20G-124-C3-R0 heat sink.
The ATS-20G-124-C3-R0 design was purposely made to support different types of environmental applications. It is made of anodized aluminum which provides excellent resistance to corrosion. This heat sink features a flat, extended fin formation which allows it to be easily integrated in limited space applications. Moreover, this design is available in many sizes and heights in order to be adapted to a specific space.
The ATS-20G-124-C3-R0 is suitable for a wide range of applications where air-cooled, liquid-cooled, or other cooling systems are required. It is widely used in radiators, high-speed chip components, automotive electronics, laser projects, industrial equipment, sensors, electronic components in 3C fields, and more.
The working principle of the ATS-20G-124-C3-R0 is through convective heat transfer. Heat is first transferred to the heat sink through either conduction or radiation. Afterward, air or an air / liquid mixture passes through the heat sink and removes the heat away. Heat transfer is optimized by increasing the air flow rate or by leveraging a fan-assisted heat sink design. As air passes through the fins of the heat sink, the air then carries away the heat from the fins which cools the surface and the components close to it. This way, the temperature is kept to a safe level.
In conclusion, the ATS-20G-124-C3-R0 heat sink is designed to address the needs of many different applications. Its flat fin design makes it suitable for limited space applications, and its extremely efficient convective heat transfer makes it a great choice for cooling sensitive components. With its reliable and efficient performance, the ATS-20G-124-C3-R0 is one of the smartest and most reliable solutions for controlling thermal management.
The specific data is subject to PDF, and the above content is for reference