| Allicdata Part #: | ATS33975-ND |
| Manufacturer Part#: |
ATS-20G-137-C2-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-137-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.01770 |
| 10 +: | $ 2.93643 |
| 25 +: | $ 2.85692 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are essential components for managing and transferring the heat away from electrical and mechanical devices. The ATS-20G-137-C2-R0 is a particular type of thermal heat sink which has various applications and different working principles.
The ATS-20G-137-C2-R0 thermal heat sink is manufactured from aluminum and is designed for use with diode and transistor applications. The unit is specifically designed with Groove technology to increase surface area and decrease thermal resistance. The ATS-20G-137-C2-R0 also has efficient thermal conduction to ensure rapid heat transfer.
Applications for the ATS-20G-137-C2-R0 include amplifiers, RF transistors, switches, diodes, and power electronics. The unit is suitable for operating temperatures up to 93°C and is compliant with MIL-STD-750 standards. The heat sink also offers a low profile for mounting applications inside confined spaces.
The thermal heat sink works on the principle of convection, whereby air or other gases provide a medium for transferring heat away from the device. The air is heated by the device and cools as it moves away through the heat sink. The body of the heat sink has an array of fins which allow the air to pass over it, further enhancing the cooling efficiency.
Also built into the ATS-20G-137-C2-R0 heat sink are three attachment holes at the base. These provide a secure mounting for the device, ensuring it does not move or suffer from vibration when in operation. The mounting holes also create pathways for the heat to move to the heat sink.
In addition, the ATS-20G-137-C2-R0 heat sink is fitted with a thermal insulation pad. This cushion acts as a thermal barrier and prevents the heat from entering the device, allowing the heat to dissipate into the air with greater efficiency. Thanks to the pad, the ATS-20G-137-C2-R0 is an ideal choice for providing long-term thermal stability.
The ATS-20G-137-C2-R0 thermal heat sink is an effective solution for efficient heat transfer in a range of applications. The superior design of the cooling fins and thermal insulation pad makes this heat sink one of the best on the market, and it is sure to provide reliable cooling and stability to any environment.
The specific data is subject to PDF, and the above content is for reference