| Allicdata Part #: | ATS-20G-143-C1-R0-ND |
| Manufacturer Part#: |
ATS-20G-143-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-143-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks: ATS-20G-143-C1-R0
Heat sinks are devices used to transfer and dissipate heat away from electronic components. Significant amount of heat is generated by electric components in various commercial, industrial and domestic applications. If the heat is not dissipated, it can affect the performance and reliability of the system. Heat sinks provide high surface areas which can dissipate the heat and in some cases provide cooling. Heat sinks are available in various materials such as aluminum and copper and various styles such as plate fin and pin fin.
The ATS-20G-143-C1-R0 is an aluminum heat sink from Aavid Thermalloy. It is designed for use in a variety of applications such as power supplies, LED lights, pumps, and motors. The ATS-20G-143-C1-R0 heat sink is available in a range of sizes, from 143mm to 185mm. It features an extruded aluminum profile with a finned area for maximum heat transfer and is suitable for both natural convection and forced convection cooling applications.
The heat sink has two integral mounting plate segments, each having about 1” in length. These mounting plates are used to attach the heat sink to the electronic device or its enclosure. This ensures the heat sink and the device are in thermal contact. The mounting plates are designed for natural convection cooling as well as forced convection cooling.
The design of the ATS-20G-143-C1-R0 allows for efficient cooling of the device even at relatively low air flow rates. This heat sink also features an anodized aluminum body and fins which are corrosion resistant and durable. The fins have a large surface area which increases the surface area in contact with the air, and thus enhances the air-cooled performance of the heat sink.
The ATS-20G-143-C1-R0 is an ideal solution for commercial and industrial applications where device cooling is required. It is a high-performance, cost-effective heat sink and can be used in a wide range of applications. It is designed to handle high thermal loads and provide excellent heat dissipation.
The specific data is subject to PDF, and the above content is for reference