ATS-20G-161-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are designed to minimize the amount of heat generated by an electronic component or electronic system heat source. They are designed to disperse or dissipate this heat away from the component or system.The ATS-20G-161-C3-R0 is a heat sink specifically designed for modern high-power applications. With its innovative design and outstanding performance, it is an ideal choice for those who are looking for components that can handle demanding operations under extreme temperatures.

Applications

The ATS-20G-161-C3-R0 is suitable for use in many industries and applications. It is an ideal solution for high-end server and workstation systems, as well as for multi-processor systems, where controlled, waste heat dissipation is key.It’s also ideal for power requirements of up to 160 Watts, making it suitable for distributed power networks and other applications in which a high degree of heat exchange is required.In addition, this heat sink is ideal for use in automotive, medical, military and aerospace applications, where stringent thermal and air flow requirements must be met.

Features

The ATS-20G-161-C3-R0 features a three-stage progressive air flow design, which ensures optimal cooling for high-power applications. Its base is constructed of anodized aluminum and is designed for maximum contact with the device to be cooled.It has a compact, lightweight package, which is ideal for difficult-to-reach locations, and it requires no additional mounting hardware, making installation a breeze.The ATS-20G-161-C3-R0 features an easy-to-use fan and air-flow control, ensuring that the best cooling performance is achieved for maximum efficiency.

Working Principle

The main principle of operation is heat dissipation. Heat is created by the source device and dissipated through a heat sink into the environment.When the thermal load is applied to the heat sink, air underneath its fins is cooled from ambient temperature to the temperature of the heat sink. As this cooled air rises from the fins, it draws in hot air from the central source device. This hot air is then dissipated to the environment.This process is repeated with continuous air flow cycles, ensuring that the heat generated by the device is dissipated efficiently.

Benefits

The ATS-20G-161-C3-R0 is an efficient heat dissipation device, which offers a number of benefits.It will keep the temperature of the device cool, thus increasing its performance and efficiency. In addition, it will prolong the life of the device and ensure that critical components are kept cool, even under demanding conditions.Finally, the ATS-20G-161-C3-R0 features a low acoustic noise level, which makes it ideal for noise-sensitive applications.

Conclusion

The ATS-20G-161-C3-R0 is a versatile and highly efficient heat sink that is suitable for a variety of applications. It is designed to provide optimal cooling for high-power devices, while remaining compact and lightweight. With its easy-to-use fan and air-flow control, and impressive thermal performance, it is the perfect choice for those looking for a reliable heat sink for their applications.

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