ATS-20G-162-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-20G-162-C1-R0-ND

Manufacturer Part#:

ATS-20G-162-C1-R0

Price: $ 3.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20G-162-C1-R0 datasheetATS-20G-162-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.42405
30 +: $ 3.23358
50 +: $ 3.04340
100 +: $ 2.85314
250 +: $ 2.66293
500 +: $ 2.47272
1000 +: $ 2.42517
Stock 1000Can Ship Immediately
$ 3.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a crucial aspect of any application that requires heat dissipation from a device or system. Heat sinks are commonly used to dissipate heat, and the ATS-20G-162-C1-R0 heat sink is no exception. The ATS-20G-162-C1-R0 is a heat sink designed to provide efficient cooling for high-power devices that generate a lot of heat. The ATS-20G-162-C1-R0 employs an effective design that helps to reduce the overall thermal load on the device or system.

The ATS-20G-162-C1-R0 heat sink utilizes a series of thermal fin elements to promote efficient cooling. The fins are arranged in a pattern that helps to dissipate the heat generated by the device or system in an efficient manner. The fins are also designed to optimize the airflow around them, ensuring that the maximum amount of cooling is obtained. This helps to reduce the thermal load on the device or system, which leads to improved performance and reliability.

In order to ensure that the ATS-20G-162-C1-R0 acts as an effective thermal management system, the heat sink is equipped with a variety of features. The first feature is a built-in temperature sensing switch that prevents the device or system from overheating. When the temperature of the system exceeds the preset threshold, the switch will automatically shut the system down to prevent damage.

The ATS-20G-162-C1-R0 is also designed to optimize its cooling performance by using an enhanced fin design. The fins are designed to provide a larger cooling surface area while maintaining a low-profile design. This helps to ensure that the heat is dissipated quickly and efficiently. The fins are also designed to provide optimal airflow, further enhancing the thermal performance of the heat sink.

The ATS-20G-162-C1-R0 is designed for applications where the device or system operates in high temperatures. The heat sink is an ideal solution for systems that require a high level of thermal performance, such as servers, gaming consoles, and power amplifiers. The ATS-20G-162-C1-R0 can also be used in military and aerospace applications where thermal performance is critical.

In conclusion, the ATS-20G-162-C1-R0 is an effective thermal management solution that combines efficient cooling with temperature sensing technology. The heat sink is designed to provide optimal thermal performance for high-power devices or systems operating in high temperatures. The ATS-20G-162-C1-R0 is an ideal solution for applications that require reliable and efficient cooling.

The specific data is subject to PDF, and the above content is for reference

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