ATS-20G-176-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.73°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-20G-176-C3-R0

The ATS-20G-176-C3-R0 is a highly efficient and reliable thermal-heat sink device, designed to help keep heat-sensitive electronics cool and operable in the most taxing conditions.Thermal heat sinks are a vital component used in high-end technology, allowing the proper dispersal of heat from a particular component or system. This is especially important for electronic and computer systems, which operate in enclosed environments. To do this, thermal heat sinks typically involve the use of a metal, or other material, that is able to absorb and dissipate heat quickly.The ATS-20G-176-C3-R0 is a particularly efficient version of this device. It is composed of a highly conductive copper material, specifically designed to disperse heat away from a component. This copper material is placed in contact with the electronic component or device that needs cooling, in order to absorb, store, and quickly disperse heat away from it. Additionally, this thermal heat sink provides maximum air flow and heat transfer.The ATS-20G-176-C3-R0’s design and construction gives it particularly specific capabilities and uses. These include its ideal compatibility with higher power devices, efficient air flow, and resilient interior structure. The device is especially appropriate for complex, power-decisive, electronic systems and components. The ATS-20G-176-C3-R0 is designed to handle temperatures of up to 175°C, with the copper material efficiently transferring this heat away from the electronics it is placed next to. The size and overall design of the device is extremely versatile, making it compatible with a variety of electronic components and systems. Its smaller size also makes it easier to place and store, requiring only minimum space, while still providing maximum efficiency. In addition to being highly efficient in its own right, the ATS-20G-176-C3-R0 is also designed to be highly power-efficient, only requiring a low amount of power to facilitate its process. The device is also extremely resilient to external elements, able to handle high levels of heat it is exposed to, as well as retaining its structure when faced with environmental pressures, such as shock, vibration, and water splashes. This also makes it less likely that this thermal heat sink will fail due to external elements.Overall, the ATS-20G-176-C3-R0 is an highly efficient and reliable device, designed for keeping a range of electronic components and systems cool and operable, in the most trying of conditions. Its efficient air flow, resilient internal structure, and small size, make it an ideal device for a variety of circumstances and technologies.

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