ATS-20G-178-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-20G-178-C3-R0ATS-20G-178-C3-R0 is a type of thermal-heat sink, which is manufactured by ATS Thermal. It is designed to effectively cool a wide range of circuit board components and other related electronic devices. The ATS-20G-178-C3-R0 thermal-heat sink is a compact, lightweight and cost-effective solution for cooling electronics quickly and evenly. Application Fields of ATS-20G-178-C3-R0ATS-20G-178-C3-R0 is primarily designed for cooling small electrical components and circuits, as for various applications. For instance, it is suitable to be used in power electronic designs to help dissipate heat, such as in power supplies, converters, and other switch-mode power supplies (SMPS). Additionally, ATS-20G-178-C3-R0 is an ideal choice for applications where durability and temperature control are critical. It enables the user to precisely monitor the temperature and maintain consistent operation across a wide range of temperatures. The product is also well suited for applications in the medical, telecommunication, and automotive fields. ATS-20G-178-C3-R0 is also used in the aerospace and military industries. It has the ability to withstand high-pressure and high temperatures, as well as protect the delicate components from corrosion and radiation. This ensures reliable and stable performance of electronics during rigorous conditions. Working Principle of ATS-20G-178-C3-R0The working principle of ATS-20G-178-C3-R0 is based on the transfer of thermal energy. Heat generated by the electronic components is used to transfer the heat to the thermal-heat sink. The thermal-heat sink features heat dissipation fins, which provide the necessary surface area that allows increased airflow to help in cool down the temperature quickly.In order to effectively dissipate the heat generated by the components, the thermal-heat sink should be placed above the components and has to be in contact with them. This helps disperse the heat more quickly and efficiently. Additionally, ATS-20G-178-C3-R0 is equipped with locating pins that help in locating the components precisely. The latter ensures that the components make contact with the thermal-heat sink easily. The ATS-20G-178-C3-R0 is designed to operate with fan units. This type of thermal-heat sink relies on air-flow-based fan cooling. The presence of fan cooling also increases the overall performance of the device in terms of heat dissipation. The fan unit helps in quickly cooling down the temperature of the device by pushing air over the surface of the thermal-heat sink. This helps in efficiently dispersing heat away from the electronics. The ATS-20G-178-C3-R0 offers a wide range of operational temperature ranges that suit different applications. It is designed to efficiently operate in temperature ranges from -50°C to 80°C. Thanks to the cooling system and fan units, the thermal-heat sink can dissipate heat efficiently even in extreme temperatures. ConclusionIn conclusion, the ATS-20G-178-C3-R0 is a thermal-heat sink designed for cooling small electrical components. It features an efficient cooling system and fan units that help in quickly cooling down the electronics within a wide range of temperatures. Its precision locating pins make it easy to position the components exactly, which enables improved performance and greater reliability. This type of thermal-heat sink is suitable for applications in various sectors, such as the medical, telecommunication, automotive, aerospace, and military industries.

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