| Allicdata Part #: | ATS-20G-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-20G-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are integral components of any electronic system, aiding the efficient functioning of all types of electronic equipment. ATS-20G-181-C3-R0 is one of the most popular thermal - heat sinks on the market today. In this article, we\'ll discuss the application field and working principle of the ATS-20G-181-C3-R0 thermal - heat sink.
The ATS-20G-181-C3-R0 thermal - heat sink is designed to duty in a range of applications, including high-power and high-density electronics, power supplies, medical equipment, servers, and other consumer electronics. The highly efficient heat dissipation of the ATS-20G-181-C3-R0 enables stable and efficient operation of all types of electronic components, ensuring maximum performance of the electronic system.
The ATS-20G-181-C3-R0 is constructed of top-notch materials such as copper and aluminum that provide durable thermal transfer performance with minimal thermal stress. The ATS-20G-181-C3-R0 uses a four-layer EMC/EMI shielding structure that is unaffected by the electromagnetic environment of a system, providing superior EMI protection.
To ensure peak performance in all conditions, the ATS-20G-181-C3-R0 thermal - heat sink is designed with an innovative, two-piece design that improves cooling efficiency while also reducing vibration and noise. The two piece design consists of a separate base plate and a top plate, which are connected with a thermal interface material. The interface material between the two plates provides excellent thermal transfer performance, allowing heat to be efficiently dissipated away from the electronic components.
In terms of its working principle, the ATS-20G-181-C3-R0 thermal - heat sink utilizes a two-level heat dissipation principle. The first level of heat dissipation is through the top plate of the ATS-20G-181-C3-R0, which dissipates heat away from the direct contact area between the top plate and the electronic components. The second level of heat dissipation is through the base plate of the ATS-20G-181-C3-R0, which dissipates the remaining heat into the surrounding environment by means of heat conduction.
The advanced design of the ATS-20G-181-C3-R0 thermal - heat sink also features an additional EMI shield which offers a high degree of protection from electromagnetic interference. This highly effective EMI shield protects the electronic components from electromagnetic noise, providing superior system reliability and performance.
Overall, the ATS-20G-181-C3-R0 thermal - heat sink is an excellent choice for any electronic system due to its efficient heat dissipation, its two-piece design, and the additional EMI shield. Thanks to its innovative design features, the ATS-20G-181-C3-R0 enables reliable operation of all types of electronic components, ensuring maximum system performance.
The specific data is subject to PDF, and the above content is for reference