| Allicdata Part #: | ATS-20G-197-C1-R0-ND |
| Manufacturer Part#: |
ATS-20G-197-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-197-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.80539 |
| 30 +: | $ 2.72979 |
| 50 +: | $ 2.57809 |
| 100 +: | $ 2.42645 |
| 250 +: | $ 2.27480 |
| 500 +: | $ 2.19898 |
| 1000 +: | $ 1.97149 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential to many applications. Heat sinks are one of the most important and effective tools for dissipating heat in electronics. In this article, the ATS-20G-197-C1-R0, a thermal device from the Aavid range of heat sinks, will be discussed. The focus will be on understanding the applications of this product and its working principles.
Introduction to ATS-20G-197-C1-R0
The ATS-20G-197-C1-R0 is a heat sink with a built-in fan. It weighs approximately 360 grams and has an overall dimension of 97mm (H) x 97mm (L) x 50.8mm (W). In addition, ATS-20G-197-C1-R0 features a 0.1m3/min air flow, and 55-75CFM (cubic feet per minute) air pressure. It is designed to operate at temperatures from 0°C to +85°C.
The ATS-20G-197-C1-R0 accommodates a range of mounting solutions such as VTSC-33 clips, self-adhesive foam, and VTTN-10 thermal interface material. This makes it a great choice for many applications.
Application Field
The ATS-20G-197-C1-R0 can be used in many areas. Primarily, it can be used for cooling electronic components by dissipating heat away from them in high-density microelectronic packages. This is especially useful in the aerospace, defense, and medical industries. Additionally, it can be used as an exhaust fan for industrial equipment such as HVAC and medical machinery.
Working Principle
The ATS-20G-197-C1-R0 uses an efficient heat transfer technique known as conduction heat transfer. Conduction heat transfer is the transfer of heat from one component to another through thermal contact. Heat is transferred from the heat source to a cooler medium, in this case from the electronic component to the heat sink, where it is dissipated into the surrounding environment.
The ATS-20G-197-C1-R0 also employs a fan to increase the efficiency of cooling. The fan directs air across the fins of the heat sink, which further enhances the transfer of heat to the environment. The air flow also helps cool the heat source, thus improving its efficiency. The fan’s efficiency depends on the speed at which it operates.
Conclusion
The ATS-20G-197-C1-R0 is an ideal thermal device for any application that requires efficient thermal management. Its compact size, light weight, and wide range of mounting options make it a practical solution for a variety of applications. Additionally, its efficient heat transfer technique and silent fan make it the perfect choice for high-density microelectronic packages and industrial machinery.
The specific data is subject to PDF, and the above content is for reference