ATS-20G-200-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20G-200-C3-R0-ND

Manufacturer Part#:

ATS-20G-200-C3-R0

Price: $ 3.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X10MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20G-200-C3-R0 datasheetATS-20G-200-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.45933
30 +: $ 3.36588
50 +: $ 3.17898
100 +: $ 2.99193
250 +: $ 2.80496
500 +: $ 2.71146
1000 +: $ 2.43095
Stock 1000Can Ship Immediately
$ 3.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.90°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management of integrated circuits is a complex task, with many different types of heat sinks on the market to choose from. The ATS-20G-200-C3-R0 is one such device, designed for managing heat generated by high powered circuits. In this article, we will explore the applications and working principles of the ATS-20G-200-C3-R0.

Applications of ATS-20G-200-C3-R0

The ATS-20G-200-C3-R0 offers a variety of application possibilities for thermal management. It can be used to cool small integrated circuits, such as microcontrollers and microprocessors. It is also suitable for more complex systems such as those with many components that require effective heat dissipation. This heat sink is designed for a wide variety of application temperatures and can be applied to both high and low power systems. Its simple and efficient design makes it the perfect choice for diverse and challenging thermal management demands.

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In addition, the ATS-20G-200-C3-R0 also offers an extensive range of features, including support for a wide range of power levels, adjustable fin design for improved cooling, and a compact and lightweight profile. This makes it ideal for applications in areas with limited space and complex thermal requirements.

Working Principle of ATS-20G-200-C3-R0

The ATS-20G-200-C3-R0 works by dissipating heat away from the heat source. It does this by utilizing a combination of thermally conductive materials, air convection and heat spreaders. The materials are designed to effectively transfer the heat away from the source and into the air, while the air convection helps dissipate the heat quickly. Heat spreaders are also used to increase the surface area of the heat sink, allowing it to dissipate more heat faster.

The ATS-20G-200-C3-R0 also features a design that greatly reduces the amount of air turbulence caused by its operation. This in turn helps to prevent the formation of hot spots, which can adversely impact the performance of the heat sink. The adjustable fin design of the ATS-20G-200-C3-R0 also allows for improved cooling performance, as the fins can be positioned to direct the airflow in the most efficient manner.

Conclusion

In conclusion, the ATS-20G-200-C3-R0 is an efficient and reliable heat sink solution that is designed to provide effective cooling for a wide variety of applications. Its adjustable fin design allows for improved performance, while its combination of thermally conductive materials and air convection ensures that the heat is dissipated quickly and safely. As such, it is the ideal choice for any thermal management task that requires the utmost performance.

The specific data is subject to PDF, and the above content is for reference

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