ATS-20G-30-C3-R0

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Thermal - Heat Sink

A heat sink is a passive device that disperses heat from a component or device, typically an integrated circuit, to a more favorable temperature. Heat sinks are commonly used in industrial applications with the purpose of controlling temperature and promoting heat dissipation. Heat sinks are also used in consumer electronics such as computers, to intelligently remove heat generated by the processor and crucial components, thus extending the life of the hardware.

The ATS-20G-30-C3-R0 heat sink is a passive thermal solution, designed for extremely high powered applications. It is capable of dissipating heat from high powered components to a more acceptable and manageable temperature. It is made of extruded aluminum and features 30 fins, which further increase the surface area exposed to the air for greater heat dissipation. Its unique fin structure design ensures heat is distributed quickly and evenly, offering excellent performance. The down-turned ends of the fin structure further increase air flow, creating a powerful and reliable air exhaust that further aids in the dissipation of heat.

The ATS-20G-30-C3-R0 heat sink features a wide working range between -55°C and 120°C and can be used in component cooling applications anywhere from -55°C to an impressive 120°C. Its tail protrudes from the base and allows for easy mounting to a wide variety of surfaces, such as metal, plastic or wood. Additionally, the sink features a thermally efficient design which reduces air resistance and maintains full contact between the heat sink and the component, further improving the cooling performance.

The ATS-20G-30-C3-R0 heat sink is designed for applications within a range of environments such as computers, consumer electronics, communications equipment, medical equipment, monitoring systems, and even aerospace engineering. It is a perfect choice for applications that require reliable long-term thermal management. Some typical applications include CPU cooling, FPGA cooling, ASIC cooling, and power amplifier cooling.

The ATS-20G-30-C3-R0 heat sink is designed to work on the principle of conduction, convection, and radiation. Heat is generated by the component and is conducted away via the base of the heat sink, then converted into thermal energy and dispersed into the surrounding air by convection. Radiation works by transferring energy from the hot surfaces of the component to cooler surrounding surfaces. This helps in reducing the temperature of the component further, thereby dissipating more heat.

The ATS-20G-30-C3-R0 heat sink provides efficient thermal performance for high-powered components, while reducing the risk of damage due to thermal shock or overheating. It is also a highly reliable solution for applications requiring long-term thermal management, and its unique fin structure design allows for a balanced and evenly distributed air flow. This heat sink is an excellent choice for a variety of applications, ranging from consumer electronics, communications equipment, and aerospace engineering to computers, monitoring systems and medical equipment.

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