ATS-20G-33-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-20G-33-C1-R0 Application Field and Working PrincipleThe ATS-20G-33-C1-R0 heatsink is one of the thermal devices in the family of Advanced Thermal Solutions (ATS). This type of heatsink is known to be one of the most efficient heat dissipaters on the market. It uses specially designed fins to draw away both convective and radiative heat away from the source.The design of the ATS-20G-33-C1-R0 heatsink is innovative yet simple. Its shape is a combination of a flat-topped base, and curved radiative and convective fins. The fins help to create a large effective surface area allowing the heatsink to have an impressive thermal performance. The ATS-20G-33-C1-R0 also features an array of regulating holes which makes it well-suited to accommodate smaller embedded or extended electronics.The ATS-20G-33-C1-R0 heatsink is widely used in the electronics industry, due its impressive performance when it comes to thermal management. It has been successfully deployed in set-top boxes, gaming consoles, healthcare equipment, network equipment, and a wide range of electronic consumer products.The ATS-20G-33-C1-R0 heatsink is considered to be a reliable and cost-effective solution and is used in applications in which cost is a major factor. This heatsink is designed to prevent heat build-up and ensure that temperatures remain at the desired levels.When it comes to the working principle of the ATS-20G-33-C1-R0 heatsink, it is based on the science of thermodynamics, which is the study of heat transfer. The ATS-20G-33-C1-R0 heatsink draws heat away from the source, usually an electric device, and into the heatsink’s fins. The fins then dissipates the heat into the surrounding environment.The ATS-20G-33-C1-R0 heatsink is also equipped with pre-installed thermal insulation materials. This helps reduce the transfer of heat into the heatsink’s body and further increases the performance of the device by boosting its thermal performance. The ATS-20G-33-C1-R0 heatsink is used in many diverse applications. Its primary use is to help keep the temperature within the specified limits by dissipating the heat away from the electronic device and into the atmosphere. This allows the device to remain cool and operate at its optimal performance level. The ATS-20G-33-C1-R0 heatsink is usually paired up with a fan, in order to increase the overall performance of the device. The fan is used to provide additional cooling to the heatsink, thus helping to keep the temperatures low. This helps improve the device’s performance and reliability.In conclusion, the ATS-20G-33-C1-R0 heatsink is a highly efficient and cost-effective thermal management solution for a variety of applications. It functions using the principles of thermodynamics, and features an array of holes to provide regulated cooling as well as pre-installed insulation materials for improved thermal performance. Its primary use is to keep temperatures within the specified limit, and when paired up with a fan, it helps to further increase the device’s level of performance and reliability.

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