| Allicdata Part #: | ATS-20G-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-20G-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics and telecommunications systems has been a hot area of research for many years. Thermal management involves the design of efficient and reliable cooling systems that can transport the heat generated by the system components to the environment. Heat sinks are one of the most widely used solutions for cooling electronics and telecommunications systems.
ATS-20G-40-C1-R0 is a material specifically designed for thermal management applications. It is a high performance, cost effective solution for a wide range of applications. Specifically, it can be used in telecommunications systems, servers, consumer electronics and specialty applications.
ATS-20G-40-C1-R0 consists of a surface mountable dielectric substrate, a metal heat sink, and four copper fins. The metal heatsink is laminated to the surface-mount dielectric substrate. The copper fins are attached to the heatsink and provide an effective, efficient heat dissipation rate. The fins provide more efficient cooling because the surface area increases the rate of heat transfer.
The exact working principle behind the ATS-20G-40-C1-R0 is dependent upon the specifics of the application. For example, in telecommunications systems, the heat produced by the system is transferred to the copper fins of the heat sink. The copper fins then absorb the heat and dissipate it to the surrounding atmosphere. The heat sink also acts as a heat sink, transferring the heat away from the hot device. Other applications may involve different cooling principles.
In order to maximize the effectiveness of ATS-20G-40-C1-R0, the system should have appropriate airflow and ventilation. Proper airflow and adequate ventilation will ensure that the heat produced by the system is properly dissipated or exhausted. Inadequate airflow or poor ventilation can reduce the effectiveness of the heat sink and will result in increased temperatures within the system.
The effectiveness of ATS-20G-40-C1-R0 is also limited by the ambient temperature. The performance of the heat sink is optimal when the ambient temperature is between 35°C and 65°C. Outside of this temperature range, the effectiveness of the heat sink will be reduced.
Overall, ATS-20G-40-C1-R0 is an effective thermal management material. It is designed to efficiently and reliably cool electronics and telecommunications systems. In addition, it is a cost-effective solution for a wide range of applications. By utilizing adequate airflow and ventilation, the heat sink can be used to effectively cool your system.
The specific data is subject to PDF, and the above content is for reference