ATS-20G-58-C1-R0

Thermal - Heat Sinks

Thermal - Heat Sinks are mechanical designs that are generally used in the electronics industry to cool or dissipate heat from internal components of an electronic device. In their most basic form, these thermal solutions consist of a mounting plate, a number of fins, and a base plate. The main purpose of this thermal technology is to transfer heat away from the device by dissipating it into the surrounding environment. By doing so, the device\'s internal temperature is kept at a consistent and safe level. One of the most popular thermal technologies used today is the ATS-20G-58-C1-R0 Heat Sink.

ATS-20G-58-C1-R0 Application Field and Working Principle

The ATS-20G-58-C1-R0 Heat Sink is a well-suited thermal technology for many electronic components. Its features help make this thermal device a top choice for many applications. This copper-coated aluminum heat sink comes in dimensions of 20 x 20 x 58 mm and provides a thermal resistance of 0.7 K/W. It is widely used in CPU cooling for personal computers, integrated circuits, communication devices, industrial equipment, and medical systems.

This heat sink features a flat surface and walls for a secure and snug fit. It has a finned base and a large area for convective heat transfer which helps draw the heat away from the heat source. The fins are arranged in a symmetrical feather-like pattern, providing excellent heat dissipation for a wide range of temperatures. Additionally, the heat sink can dissipate up to 8W of power while running at 2.8volts DC.

The ATS-20G-58-C1-R0 Heat Sink works using a combination of conduction and convection thermal transfer. Heat is first conducted away from the hot spot (such as the CPU) to the heat sink using a thermal interface material. The thermal interface material conducts the heat from the CPU to the heat sink itself. Then, the heat is dissipated into the environment via a convection process. As air passes over the fins, the air carries away the heat waves which reduces the heat sink’s temperature. By using a combination of conduction and convection, the ATS-20G-58-C1-R0 Heat Sink is capable of achieving high levels of thermal resistance in a variety of environments.

The ATS-20G-58-C1-R0 Heat Sink is a cost-efficient and reliable solution for reducing the internal temperature of an electronic device and extending its lifespan. By using heat sink fins to dissipate the generated heat away from the device, the device is provided increased reliability and its internal components stay cool and operational.