| Allicdata Part #: | ATS34100-ND |
| Manufacturer Part#: |
ATS-20G-77-C2-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-77-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.54060 |
| 10 +: | $ 3.44673 |
| 25 +: | $ 3.25534 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-20G-77-C2-R0 is a thermal-heat sink designed to efficiently transfer heat away from an electronic or mechanical component that generates excessive heat due to high power density and/or high current draw. This heat sink is typically used in high-power devices such as high-efficiency DC/DC converters, power amplifiers, and motors.
The ATS-20G-77-C2-R0 is a metallic component, usually made of aluminum, which is designed to accelerate the flow of heat away from components, thus helping them to run cooler in order to maintain a longer life-span and better performance. It is typically composed of multiple thin fins arranged in a manner that promotes a greater heat transfer surface for maximum thermal conduction. The fins are arranged in such a fashion that the air flows through them more efficiently, thus allowing the heat to dissipate away from the component faster.
The ATS-20G-77-C2-R0 has two primary functions in its application field. The first is to improve the overall thermal performance of the device that is generating the heat by providing a greater heat transfer surface than could be obtained with the device alone. The second is to protect other components in the device from the induced heat. The fin materials used in the design of the ATS-20G-77-C2-R0 enable the heat to be pulled away from the operating components and dissipated into the surrounding environment, thus preventing any damage from occurring to them.
The ATS-20G-77-C2-R0 works on the principle of convection. The air around the fins is heated and then rises upward, carrying the heat away from the component and dissipating it into the atmosphere. This type of cooling process is known as natural convection cooling and is highly effective at removing large amounts of heat from components.
The ATS-20G-77-C2-R0 is a cost-effective way to improve the efficiency and lifespan of high-power devices. In addition to its thermal advantages, it also provides added mechanical protection for the components, allowing them to operate at their higher power ratings without the risk of physical damage due to excessive heat from other nearby components.
The specific data is subject to PDF, and the above content is for reference