ATS-20G-77-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20G-77-C3-R0-ND

Manufacturer Part#:

ATS-20G-77-C3-R0

Price: $ 3.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X30MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20G-77-C3-R0 datasheetATS-20G-77-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.42405
30 +: $ 3.23358
50 +: $ 3.04340
100 +: $ 2.85314
250 +: $ 2.66293
500 +: $ 2.47272
1000 +: $ 2.42517
Stock 1000Can Ship Immediately
$ 3.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays a critical role in the performance of many applications. Heat sinks are commonly used to transfer or dissipate heat from components or systems that generate too much of it. The ATS-20G-77-C3-R0 is a heat sink designed to provide efficient and reliable heat dissipation in a wide range of applications.

The ATS-20G-77-C3-R0 is a metal aluminum-graphite heat sink. It features an optimum design with layered aluminum and graphite materials that allow for improved heat transfer with the help of a on-board heat pipe. The aluminum base layer features thermal fins with high conductivity. The graphite layer is in the top layer, which enhances the heat transfer with its high thermal resistance. The material combination ensures high thermal efficiency and performance of the ATS-20G-77-C3-R0.

The ATS-20G-77-C3-R0 is designed with a robust and sturdy framework. The thin and light aluminum body provides durability and allows it to be mounted in the tightest spaces. It is only 4mm thick and has an overall weight of 15.9g, which makes it easy to handle and install. It also features a dual hole tangential exit design that ensures maximum airflow and effective heat dispersion.

The ATS-20G-77-C3-R0 offers superior performance in various operating environments due to its low noise properties and high efficiency. It is designed to operate without any active cooling, up to temperatures 125°C and can handle peak temperatures up to 135°C without any damage. Additionally, the ATS-20G-77-C3-R0 has an efficient working range of 10-150W which makes it perfect for medium to high-power applications where cooling is a must.

The ATS-20G-77-C3-R0 is also designed for a wide range of applications such as servers, data centers, industrial computing systems, and other thermal solutions. It is also well suited for use in battery-powered devices such as mobile phones, tablets, and notebooks. It can be used during high-performance gaming and other computing activities where cooling and thermal management is essential.

The ATS-20G-77-C3-R0 is designed to provide an optimal cooling solution in tight spaces. Its thin and light aluminum body ensures quick and easy integration into any application. The unique dual layer aluminum-graphite design provides an effective way to dissipate heat efficiently and reliably. In addition, the powerful fanless heat sink allows it to operate in temperatures up to 125°C without active cooling. The ATS-20G-77-C3-R0 is an ideal thermal solution for a wide range of applications where cooling and thermal management is critical.

The specific data is subject to PDF, and the above content is for reference

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