| Allicdata Part #: | ATS-20G-78-C3-R0-ND |
| Manufacturer Part#: |
ATS-20G-78-C3-R0 |
| Price: | $ 3.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-78-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.47004 |
| 30 +: | $ 3.27726 |
| 50 +: | $ 3.08448 |
| 100 +: | $ 2.89170 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.50614 |
| 1000 +: | $ 2.45794 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important for electronics and other related products as technology advances and increasingly powerful devices are developed. Heat sinks are an integral component in any effective thermally managed system, and their performance can significantly influence overall system performance. The ATS-20G-78-C3-R0 is a high performance heat sink designed to address many of the challenges presented by high-dissipation thermal requirements.
The ATS-20G-78-C3-R0 is a thermal solution designed for LED lighting applications, offering an optimal lifetime and superior thermal performance. It has been tested and proved to be able to dissipate up to 20 watts of power. The high thermal efficiency of the ATS-20G-78-C3-R0 is enabled by its unique copper construction with fins, which optimizes airflow and surface area contact for efficient heat transfer. The structure also helps reduce weight and size, making the solution perfect for applications with limited space.
The ATS-20G-78-C3-R0 also features a range of features that make it suitable for both standard and demanding applications. It utilizes a gold plated thermal interface material layer, providing an improved connection between the base and the final metal layer. This layer also helps ensure a consistent thermal performance over a wide range of temperatures from -20degC to 60degC. Additionally, the ATS-20G-78-C3-R0 is designed for easy assembly and installation while its 4-pin connectors offer reliable and secure connection to the product for long-term stability.
To ensure efficient heat transfer, the ATS-20G-78-C3-R0 has a wide range of features to remove as much heat as possible. Its patented fin design helps guide air flow over the surfaces of the heat sink, allowing for a greater level of efficient heat transfer. Additionally, its copper construction boasts good thermal conductivity and mechanical strength, which is further enhanced by its copper layer coating. Its internal heat pipe technology further enhances thermal performance by increasing air flow across the heat sink and helps to remove heat more efficiently.
The ATS-20G-78-C3-R0’s excellent thermal performance and its compact size make it ideal for LED lighting applications with intensive thermal requirements. By removing more heat and transferring it to the surrounding environment, the ATS-20G-78-C3-R0 controls temperature within the system, allowing it to operate safely and efficiently. For installations with limited space, it can be attached to the surface via its 4-pin connector, making it a simple and straightforward solution for thermal management.
The specific data is subject to PDF, and the above content is for reference