| Allicdata Part #: | ATS-20G-98-C1-R0-ND |
| Manufacturer Part#: |
ATS-20G-98-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20G-98-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any electrical or mechanical operation. ATS-20G-98-C1-R0 heat sinks are used to dissipate heat from a variety of components and circuits located in demanding applications where heat is a major constraint. Heat sinks are an integral part of any electronic system, providing efficient thermal management that is essential for proper system performance and reliability.
The ATS-20G-98-C1-R0 heat sink is a compact, lightweight device composed of a base, fins, and optional accessories such as fans. The base is typically composed of anodized aluminum or copper, while the fins are made from a thermally conductive material like copper or aluminum. The fins are designed to maximize the surface area and air flow around the component, thus improving cooling efficiency and reducing the operating temperature of the component.
The working principle behind ATS-20G-98-C1-R0 heat sinks is that heat is transferred from the heat-generating component to the heat sink. The heat transfers from the component to the fins of the heat sink, where it is then dissipated into the surrounding air. As air passes over the fins of the heat sink, it absorbs the heat, reducing the temperature of the component. With the heat thus removed, the component can then operate at its optimum performance.
ATS-20G-98-C1-R0 heat sinks are suitable for use in a variety of applications. They are especially well-suited for applications where space and weight are limited, as they require minimal mounting hardware and have a low profile design. In addition, they offer enhanced cooling performance compared to traditional passive heat sinks due to their ability to draw heat away from the component more efficiently and effectively.
This heat sink is also ideal for applications that require rapid heat dissipation, such as electric vehicles, telecommunication equipment, multimedia displays, medical equipment and other high-power electronic devices. Additionally, they are suitable for extreme temperature applications where the ambient temperature exceeds the typical operating range for traditional heat sinks.
In summary, the ATS-20G-98-C1-R0 heat sink is an invaluable thermal management solution for a wide variety of applications. With its high performance and lightweight design, the device provides efficient heat dissipation that is required for proper system performance and reliability.
The specific data is subject to PDF, and the above content is for reference