| Allicdata Part #: | ATS-20H-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-20H-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in modern electronics. Heat is a byproduct of electronics, and if it is not properly dissipated, it can cause operational problems. Heat sinks are often used to keep devices cool. The ATS-20H-01-C3-R0 is a specific type of heat sink device, and it is used in various applications.
The ATS-20H-01-C3-R0 is a high performance heat sink with a fin pattern of rectangular shape. As a compact solution, it is designed for use in electronic applications where a larger traditional heat sink may not be suitable due to limited space requirements. It is suitable for heat dissipation applications that have higher temperatures, and it is suitable for applications in both natural convection and forced convection.
The ATS-20H-01-C3-R0 is designed to provide thermal management for power supplies, LED fixtures, power converters, and other similar electronics. It is also suitable for high-end gaming systems, automotive electronics and home theater systems. The device is suitable for dissipating heat in applications up to 65°C. It is a lightweight, compact device that is easy to install and maintain.
The ATS-20H-01-C3-R0 has a high performance thermal design that provides excellent cooling. It utilizes a thermally conductive aluminum base which is connected to a copper fin lattice. The aluminum base is designed to evenly distribute the heat from the device to the entire fin lattice. The copper fin lattice is designed to provide maximum surface area for efficient heat dissipation. The design of the heat sink also includes channels that are designed to allow air to pass freely through the fins, allowing for improved airflow and enhanced cooling.
The ATS-20H-01-C3-R0 has an optimized fanless design that helps eliminate fan noise. This helps to reduce overall noise levels and allow for enhanced cooling capabilities. The device is also designed to increase overall system efficiency by improving airflow and cooling capabilities for electronics. The device also has a wide range of applications due to its lightweight and compact size.
The ATS-20H-01-C3-R0 has a working principle of passive cooling. This means that it does not require any external power or fan in order to work. This helps to reduce the overall system cost, as it does not require additional power or fans for the system. The device is also designed to be compatible with a wide range of processors, and it is designed to be easily connectable to other components.
The ATS-20H-01-C3-R0 is an ideal device for cooling and thermal management of electronic devices. Its compact size, lightweight, and fanless design allow it to work effectively in tight spaces. It is also a cost-effective solution for thermal management, as it does not require additional power or fans for its operation. Its wide range of applications makes it a popular choice for many applications, ranging from power supplies and LED fixtures to gaming systems and automotive electronics.
The specific data is subject to PDF, and the above content is for reference