ATS-20H-117-C1-R0

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Thermal - Heat Sinks

Heat sinks, generally speaking, are designed to dissipate heat away from components and circuitry in order to keep them at optimal operating temperature. ATS-20H-117-C1-R0 is a type of heat sink specifically designed for such applications. In this article, we shall discuss its application fields and working principle.

Application Field of ATS-20H-117-C1-R0 Heat Sink

ATS-20H-117-C1-R0 heat sink is a small generalized type of heat sink that can be implemented in multiple application fields. It is mainly applied in applications such as telecom base stations, switching device, highly integrated electronic circuits, and various electric devices. It is perfect for electronic products with an integrated circuit and other electrical devices that generate large amounts of heat. Due to the materials used to make the sink and its design, it can dissipate larger amounts of heat more quickly.

Apart from dissipating heat, this heat sink also offers considerable noise reduction. The die-stamped fin structure, optimized rib height of fin, and reputed thermal conductivity ensure its effectively working in noise reduction. By using this heat sink, the operating temperatures can be stabilized and the environment can be kept noiseless. This is especially true for applications in telecom base station and switching devices.

Working Principle of ATS-20H-117-C1-R0 Heat Sink

The working principle of ATS-20H-117-C1-R0 heat sink can be explained by examining the structure of the sink. It is constructed from aluminum die-cast material that includes a top plate, a bottom plate, and side walls. The die-stamped fin structure increases the surface area of the heat sink, allowing it to dissipate heat more efficiently. The optimized rib height of fins further improves the cooling effect. In addition, the thermal conductivity of aluminum ensures effective heat dissipation.

The heat from the components or circuits is absorbed by the heat sink and dissipated away with the help of a fan. The fan helps to draw air into the center area of the side walls and fins. This creates a vacuum inside the heat sink and causes a convection flow of air. The air passes over the fins and absorbs the heat, which is then dissipated into the atmosphere. This circulation of air helps to cool the components or circuits, allowing them to operate at optimal temperatures.

Conclusion

Thermal - Heat Sinks most commonly used in equipment containing electronic components or circuits, such as telecom base stations, switching devices, and integrated circuits, are designed to dissipate the heat they generate to prevent them from reaching overheat and, thus, malfunctioning. ATS-20H-117-C1-R0 is a type of heat sink specifically designed to do just that. Its die-stamped fin structure and optimized rib heights of fin structure allow it to absorb and dissipate more heat more quickly, keeping the components and circuits in optimal operating temperature.

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