| Allicdata Part #: | ATS-20H-119-C3-R0-ND |
| Manufacturer Part#: |
ATS-20H-119-C3-R0 |
| Price: | $ 3.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-119-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.38814 |
| 30 +: | $ 3.29658 |
| 50 +: | $ 3.11346 |
| 100 +: | $ 2.93026 |
| 250 +: | $ 2.74713 |
| 500 +: | $ 2.65555 |
| 1000 +: | $ 2.38083 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are responsible for dissipating heat from the components they are connected to in order to prevent overheating and other damage. The ATS-20H-119-C3-R0 is one such thermal heat sink, and it has a variety of application fields, as well as a working principle to keep the components cool.
Application
The ATS-20H-119-C3-R0 is a highly versatile thermal heat sink that can be used in a wide range of applications. The heat sink is suitable for high-power static dissipation applications in PCBs, as well as providing temperature control on electric and hybrid vehicles, and cooling medical equipment. It is ideally suited for applications where a high-performance thermal solution is needed in order to provide reliable, high-power dissipation.
The ATS-20H-119-C3-R0 is designed for use in a variety of industrial environments, and can handle temperature profiles up to +150°C. It is also highly resistant to corrosion and can withstand temperatures ranging from -55°C to +150°C. The heat sink is suitable for a variety of applications, including automotive, industrial, medical, and consumer electronics.
The ATS-20H-119-C3-R0 is an ideal solution for cooling electronic components and systems. It is suitable for use in circuit boards, medical testing equipment, medical imaging equipment, and automotive applications. The heat sink is also designed for use in electrical power distribution systems, vehicle electronics, and consumer products, allowing for improved system performance in a range of different environments.
Working Principle
The ATS-20H-119-C3-R0 is a thermal heat sink that works according to a principle of thermal convection. The heat sink consists of an aluminum base plate with a copper fin attached to it. As the heat is generated by the component being dissipated, the copper fin re-radiates this heat into the atmosphere. As the heat is re-radiated, the base plate acts as an insulator, dissipating the heat from the component into the atmosphere, thus preventing excess heat build-up.
The heat dissipating efficiency of the ATS-20H-119-C3-R0 is attributable to its well-designed structure and high thermal conductivity. The aluminum base plate provides excellent heat transfer capacity, while the copper fin’s air-cell design increases surface area to help dissipate heat more efficiently. The optimal structure of the heat sink ensures maximum effectiveness in heat dissipation, while also allowing for improved heat transfer between the component and the heat sink.
The ATS-20H-119-C3-R0 is capable of dissipating high power static dissipations, providing reliable cooling for PCBs, electric and hybrid vehicles, and medical equipment. The combination of its efficient thermal performance, robust construction, and reliable thermal convection principle make the ATS-20H-119-C3-R0 an excellent choice for a range of applications.
The specific data is subject to PDF, and the above content is for reference